Input current limited power supply and audio power amplifier for high power reproduction of nondeterministic signals
US-9209767-B1 · Dec 8, 2015 · US
US9338546B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9338546-B2 |
| Application number | US-201314107965-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 16, 2013 |
| Priority date | Dec 16, 2013 |
| Publication date | May 10, 2016 |
| Grant date | May 10, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A circuit assembly and a method for processing an input signal are disclosed. In one embodiment a circuit assembly comprises a voltage provider configured to receive a supply voltage and to provide an internal supply voltage higher than the supply voltage and a signal follower coupled to an output port of the voltage provider, the signal follower being configured to receive the internal supply voltage and the input signal, and to provide an output signal depending on the input signal.
Opening claim text (preview).
What is claimed is: 1. A circuit assembly for processing an input signal, comprising: a voltage provider configured to receive a supply voltage and to provide an internal supply voltage higher than the supply voltage; and a signal follower coupled to an output port of the voltage provider, the signal follower being configured to receive the internal supply voltage and the input signal, and to provide an output signal depending on the input signal. 2. The circuit assembly according to claim 1 , further comprising a bypass paralleling the voltage provider so that the signal follower is configured to receive the supply voltage instead of the internal supply voltage when the bypass is activated. 3. The circuit assembly according to claim 1 , further comprising a low-dropout regulator (LDO) configured to receive and to regulate an external supply voltage and to provide the supply voltage to the voltage provider. 4. The circuit assembly according to claim 1 , further comprising an amplifier configured to receive the output signal and to provide an amplified output signal. 5. The circuit assembly according to claim 1 , further comprising an analog-to-digital converter (ADC) configured to receive the output signal or an amplified output signal and to provide a digital signal. 6. The circuit assembly according to claim 1 , wherein the circuit assembly is implemented within an application-specific integrated circuit (ASIC). 7. The circuit assembly according to claim 1 , wherein the voltage provider is a voltage multiplier. 8. The circuit assembly according to claim 1 , wherein the signal follower is a source follower. 9. The circuit assembly according to claim 1 , wherein the input signal is a microphone signal provided by a microphone. 10. A microphone assembly comprising: a microphone configured to provide a raw microphone signal; a circuit assembly for processing an input signal, the circuit assembly comprising a voltage provider configured to receive a supply voltage and to provide an internal supply voltage higher than the supply voltage; and a signal follower coupled to an output port of the voltage provider, the signal follower being configured to receive the internal supply voltage and the raw microphone signal as an input signal, and to provide an output signal depending on the input signal. 11. The microphone assembly according to claim 10 , wherein the microphone comprises a microelectromechanical system (MEMS). 12. The microphone assembly according to claim 10 , wherein the microphone and the circuit assembly are integrated within a common package.
Mems transducers or their use · CPC title
Microphones (H04R19/01 takes precedence) · CPC title
Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title
using semiconductor materials · CPC title
Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.