Chip on flex optical subassembly

Patent metadata

Field	Value
Publication number	US-9337932-B2
Application number	US-201213715738-A
Country	US
Kind code	B2
Filing date	Dec 14, 2012
Priority date	Dec 14, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

First claim

What is claimed is:

1. An optical subassembly comprising:
a flex circuit constructed of at least one electrically-conductive layer and at least one electrical insulator layer;
an optical port defining a barrel cavity and a fiber receiver configured to receive an optical fiber, wherein the optical port is mechanically coupled to the flex circuit at a flex connection;
an active optical component subassembly that is positioned within the barrel cavity, electrically coupled to the flex circuit, and that includes at least one active optical component that is mechanically coupled directly to the flex circuit; and
a plate through which an optical signal that is communicated by at least one component of the active optical component subassembly passes, wherein the plate is fixed to the optical port and positioned within the barrel cavity between the active optical component subassembly and the fiber receiver.

2. The optical subassembly of claim 1 , wherein the active optical component subassembly comprises an optical transmitter.

3. The optical subassembly of claim 2 , wherein the optical transmitter comprises a vertical cavity surface emitting laser (VCSEL).

4. The optical subassembly of claim 3 , wherein the active optical component subassembly comprises a monitor photodiode and a spacer/heat dissipater, the spacer heat/dissipater spacer/heat dissipater being directly mounted to the flex circuit at a connection region and the monitor photodiode and the VCSEL being mounted to a spacer top surface of the spacer heat/dissipater.

5. The optical subassembly of claim 1 , further comprising a heat sink stiffener affixed to the flex circuit and configured to stiffen at least some portion of the flex circuit and act as a thermal sink for heat generated during operation of the optical subassembly.

6. The optical subassembly of claim 5 , wherein the active optical component subassembly is mechanically mounted to a contact face of the heat sink stiffener.

7. The optical subassembly of claim 1 , wherein the flex circuit comprises:
an optical component subassembly connection region to which the active optical component subassembly is electrically coupled; and
a printed circuit board (PCB) flex connection configured to be mechanically coupled to a PCB and to communicate electrical signals between the PCB and the optical component subassembly connection region.

8. The optical subassembly of claim 1 , wherein the active optical component subassembly comprises a PIN photodiode or an avalanche photodiode (“APD”).

9. An optical subassembly comprising:
an optical port that defines a fiber receiver that is configured to receive an optical fiber and that defines a barrel cavity having a first barrel opening defined on a first side of the optical port and a second barrel opening defined on a second side of the optical port;
a flex circuit that includes a first portion that extends along, substantially covers, and is mechanically coupled to the first barrel opening and a second portion that extends along, substantially covers, and is mechanically coupled to the second barrel opening;
a first active optical component subassembly that is electrically coupled to the first portion of the flex circuit such that the first active optical component subassembly is positioned within the barrel cavity;
a second active optical component subassembly that is electrically coupled to the second portion of the flex circuit such that the second active optical component subassembly is positioned within the barrel cavity; and
a bidirectional filter that is positioned in the barrel cavity defined by the optical port, the bidirectional filter configured to allow outbound optical signals emitted by the first active optical component subassembly to pass therethrough and to reflect inbound optical signals towards the second active optical component subassembly.

10. The optical subassembly of claim 9 , wherein the first active optical component subassembly is configured to emit outbound optical signals through the barrel cavity; and the second active optical component is configured to receive inbound optical signals through the barrel cavity.

11. The optical subassembly of claim 9 , wherein the flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer.

12. A transceiver module comprising the optical subassembly of claim 9 .

13. A method of constructing an array of chip on flex optical subassemblies, the method comprising:
epoxying a top cover, a top metal, a core, a bottom metal, and a bottom cover to create an array of flex circuits;
epoxying the array of flex circuits to a perimeter-mounting structure configured to support borders of the top cover, the top metal, the core, the bottom metal, and the bottom cover during construction of the array of chip on flex optical subassemblies;
attaching a different one of a plurality of heat sink stiffeners to each of the flex circuits in the array of flex circuits;
electrically coupling a different one of a plurality of active optical component subassemblies to each of the flex circuits in the array of flex circuits;
mechanically coupling at least one active optical component of each of the plurality of active optical component subassemblies to each of the flex circuits in the array of flex circuits; and
mounting a different one of a plurality of optical ports to each of the flex circuits in the array of flex circuits such that each of the plurality of active optical component subassemblies is positioned within a barrel cavity defined by one of the plurality of optical ports.

14. The method of claim 13 , further comprising simultaneously conducting a burn-in procedure on the array of chip on flex optical subassemblies.

15. The method of claim 13 , further comprising mechanically coupling a different one of the plurality of active optical component subassemblies to each of the plurality of heat sink stiffeners.

16. The method of claim 13 , further comprising cutting individual chip on flex optical subassemblies from the array of chip on flex optical subassemblies.

17. The optical subassembly of claim 9 , wherein
the first side and the second side are orthogonal with respect to one another.

Assignees

• Finisar Corp

Inventors

• Stapleton Brent
• Dwivedi Rajeev
• Walker Jr Harold Young
• Landry Gary

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title