Light emitting device package

Patent metadata

Field	Value
Publication number	US-9337401-B2
Application number	US-201213366945-A
Country	US
Kind code	B2
Filing date	Feb 6, 2012
Priority date	May 26, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A light emitting device package according to one exemplary embodiment includes a sealing material and organic particles. The organic particles enhance a heat discharge rate and thus reliability of the light emitting device package due to excellent thermal characteristics thereof. Moreover, the organic particles achieve an optical distribution effect to enhance light extraction efficiency of the light emitting device package.

First claim

What is claimed is:

1. A light emitting device package comprising:
a light source;
a lead frame to mount the light source thereon and being electrically connected to the light source, the lead frame comprising first and second electrically conductive lead frames being spaced from each other;
a mold member disposed over the light source and including a sealing material, a fluorescent substance, and organic particles over the lead frame, wherein the entire organic particle is organic, wherein each of the organic particles comprises a coating layer to coat the organic particle, wherein the coating layer has an index of refraction different from that of the organic particle,
wherein a proportion of the organic particles to the sealing material is in a range of 1 wt % to 20 wt %.

2. The package of claim 1 , wherein the organic particles includes at least one selected from a group consisting of PTFE (polytetrafluoroethylene), PSTm, phenolic resin, PMMA (polymethylmethacrylate), PVC and styrene-copolymer.

3. The package of claim 1 , wherein each of the organic particles has an index of refraction in a range of 1.6 to 1.7.

4. The package of claim 1 , wherein the organic particles include at least one of spherical, hexahedral, cylindrical and regular polyhedral shapes.

5. The package of claim 1 , wherein the organic particles are formed as combinations of two or more of a sphere, hexahedron, cylinder and regular polyhedron.

6. The package of claim 1 , wherein the organic particles include a width or diameter in a range of 1 nm to 80000 nm.

7. The package of claim 1 , wherein the coating layer has an index of refraction larger than of the organic particle.

8. The package of claim 1 , wherein each of the organic particles comprises a hollow space formed therein.

9. The package of claim 1 , further comprising a body having a cavity formed therein to accommodate the light source,
wherein the mold member fills the cavity.

10. The package of claim 9 , further comprising a reflective layer formed on a side wall surface of the cavity.

11. The package of claim 9 , further comprising a hole formed in a bottom portion of the body, the hole being disposed beneath the light source.

12. The package of claim 9 , further comprising a sheet disposed over the body to cover the cavity, wherein the sheet comprises at least one selected from among titanium dioxide (TiO 2 ), silicon dioxide (SiO 2 ), zinc oxide (ZnO), barium sulfate (BaSO 4 ), calcium carbonate (CaCO 3 ), magnesium carbonate (MgCO 3 ), aluminum hydroxide (Al(OH) 3 ) and clay.

13. The package of claim 1 , wherein the sealing material comprises silicon, epoxy resin and/or another resin material.

14. The package of claim 1 , wherein the sealing material comprises at least a first sealing material layer and a second sealing material layer on the first sealing material layer.

15. The package of claim 14 , wherein the organic particles are placed in the first sealing material layer, and fluorescent substances are placed in the second sealing material layer.

16. The package of claim 1 , wherein the sealing material further comprises fluorescent substances to change a wavelength of light generated from the light source.

17. The package of claim 1 , wherein the sealing material further comprises a light diffusive material to diffuse light emitted from the light source.

18. An illumination device comprising a light emitting device package, the package comprising:
a light source;
a lead frame to mount the light source thereon and being electrically connected to the light source, the lead frame comprising first and second lead frames being spaced from each other;
a body having a cavity formed therein to accommodate the light source and lead frame; and
a mold member disposed over the light source and including a sealing material and organic particles over the lead frame, wherein the entire organic particle is organic, wherein each of the organic particles comprises a coating layer to coat the organic particle, wherein the coating layer has an index of refraction different from that of the organic particle,
wherein the organic particles is at least one of PTEE (polytetrafluoroethylene), PSTm, phenolic resin, PMMA (polymethylmethacrylate), PVC or styrene-copolymer, and
wherein a proportion of the organic particles to the sealing material is in a range of 0.5 wt % to 30 wt %.

19. A backlight unit comprising a light emitting device package, the package comprising:
a light source;
a lead frame to mount the light source thereon and being electrically connected to the light source, the lead frame comprising first and second lead frames being spaced from each other;
a body having a cavity formed therein to accommodate the light source and lead frame; and
a mold member disposed over the light source and including a sealing material and entirely organic particles over the lead frame, wherein the entire organic particle is organic, wherein each of the organic particles comprises a coating layer to coat the organic particle, wherein the coating layer has an index of refraction different from that of the organic particle,
wherein the organic particles is at least one of PTEE (polytetrafluoroethylene), PSTm, phenolic resin, PMMA (polymethylmethacrylate), PVC or styrene-copolymer, and
wherein a proportion of the organic particles to the sealing material is in a range of 0.5 wt % to 30 wt %.

Assignees

• Lee Sangyoul
• Lg Innotek Co Ltd

Inventors

• Lee Sangyoul

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/854 Primary

  characterised by their material, e.g. epoxy or silicone resins · CPC title