Light-emitting diode and fabrication method thereof

US9337384B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9337384-B2
Application numberUS-201514643394-A
CountryUS
Kind codeB2
Filing dateMar 10, 2015
Priority dateNov 8, 2012
Publication dateMay 10, 2016
Grant dateMay 10, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A light-emitting diode includes a substrate; a light-emitting epitaxial layer, laminated by semiconductor material layers and formed over the substrate; a first current spreading layer over the light-emitting epitaxial layer; an adhesive layer with alternating second current spreading layers and first metal barrier layers over the first current spreading layer, including three structure layers; a second metal barrier layer over the adhesive layer with alternating second current spreading layers and metal barrier layers; and a metal electrode layer over the second metal barrier layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A light-emitting diode comprising: a substrate; a light-emitting epitaxial layer formed over the substrate; a first current spreading layer over the light-emitting epitaxial layer; an adhesive layer with alternating second current spreading layers and first metal barrier layers over the first current spreading layer; wherein the adhesive layer includes: a first layer including a second current spreading layers; a second layer including alternating the second current spreading layers and a first metal barrier layers; and a third layer including the first metal barrier layers; a second metal barrier layer over the adhesive layer; and a metal electrode layer over the second metal barrier layer. 2. The light-emitting diode of claim 1 , wherein the first current spreading layer has a thickness of about 500-5000 Å. 3. The light-emitting diode of claim 1 , wherein the first layer has a thickness of about 100-800 Å. 4. The light-emitting diode of claim 1 , wherein the second layer has a thickness of about 50-200 Å. 5. The light-emitting diode of claim 1 , wherein the third layer has a thickness of about 100-500 Å. 6. The light-emitting diode of claim 1 , wherein the adhesive layer comprises about 6-50 alternating layers. 7. The light-emitting diode of claim 1 , wherein the second current spreading layer is composed of a same material as the first current spreading layer. 8. A light-emitting system comprising a plurality of light-emitting diode, each light-emitting diode including: a substrate; a light-emitting epitaxial layer formed over the substrate; a first current spreading layer over the light-emitting epitaxial layer; an adhesive layer with alternating second current spreading layers and first metal barrier layers over the first current spreading layer; wherein the adhesive layer includes: a first layer including a second current spreading layers; a second layer including alternating the second current spreading layers and a first metal barrier layers; and a third layer including the first metal barrier layers; a second metal barrier layer over the adhesive layer; and a metal electrode layer over the second metal barrier layer. 9. The system of claim 8 , wherein the first current spreading layer has a thickness of about 500-5000 Å. 10. The system of claim 8 , wherein the first layer has a thickness of about 100-800 Å. 11. The system of claim 8 , wherein the second layer has a thickness of about 50-200 Å. 12. The system of claim 8 , wherein the third layer has a thickness of about 100-500 Å. 13. The system of claim 8 , wherein the adhesive layer comprises about 6-50 alternating layers. 14. The system of claim 8 , wherein the second current spreading layer is composed of a same material as the first current spreading layer.

Assignees

Inventors

Classifications

  • containing nitrogen, e.g. GaN · CPC title

  • of packages · CPC title

  • of electrodes · CPC title

  • H10H20/832Primary

    characterised by their material · CPC title

  • having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9337384B2 cover?
A light-emitting diode includes a substrate; a light-emitting epitaxial layer, laminated by semiconductor material layers and formed over the substrate; a first current spreading layer over the light-emitting epitaxial layer; an adhesive layer with alternating second current spreading layers and first metal barrier layers over the first current spreading layer, including three structure layers;…
Who is the assignee on this patent?
Xiamen Sanan Optoelectronics Technology Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10H20/832. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 10 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).