Template and pattern forming method

Patent metadata

Field	Value
Publication number	US-9335627-B2
Application number	US-76028210-A
Country	US
Kind code	B2
Filing date	Apr 14, 2010
Priority date	Sep 24, 2009
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A template for imprinting in which a pattern is transferred onto a first substrate applied curable resin thereon, including a second substrate having a surface to be contacted with the curable resin, a concave portion provided on the surface and corresponding to a pattern to be transferred onto the first substrate, and at least one convex portion arranged in the concave portion to decrease volume of the concave portion.

First claim

What is claimed is:

1. A template used for printing in which a pattern is transferred onto a curable resin applied on a first substrate, the pattern comprises a large pattern of a pad, a dummy pattern, or a mark having a dimension of 100 nm or more, and a fine pattern smaller than the large pattern, the fine pattern having a connecting wiring pattern formed in a first direction or a dummy connecting wiring pattern formed in the first direction, the connecting wiring pattern or the dummy connecting wiring pattern being connected to the large pattern, the template further comprising;
a second substrate having a surface to be contacted with the curable resin;
a first convex portion configured to surround an area of the surface, the area and the convex portion defining a concave portion, a contour of the concave portion corresponding to a contour of the large pattern and the fine pattern to be transferred onto the curable resin;
a plurality of second convex portions arranged in the concave portion, and configured to decrease volume of the concave portion, the plurality of convex portions being arranged in first and second directions, the second direction being nonparallel to the first direction, the concave portion not being divided into closed areas by the plurality of second convex portions.

2. The template according to claim 1 , wherein the plurality of second convex portions arranged in the first directions and the connecting wiring pattern are formed on a same line.

3. The template according to claim 1 , wherein the plurality of second convex portions are not formed in the concave portion of the fine pattern.

4. The template according to claim 1 , wherein the second substrate, the first convex portion, and the plurality of second convex portions are made of quartz.

5. The template according to claim 1 , wherein intervals of the plurality of second convex portions are smaller than a width of the fine pattern.

Assignees

• Kikuchi Yukiko
• Ito Shinichi
• Toshiba Kk

Inventors

• Kikuchi Yukiko
• Ito Shinichi

Classifications

• H10P76/4088

  Processes for improving the resolution of the masks · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10W72/951

  Materials of bond pads · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title