Sample holder for prism-based analytical instruments
US-2024118201-A1 · Apr 11, 2024 · US
US9335262B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9335262-B2 |
| Application number | US-201113217859-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2011 |
| Priority date | Aug 25, 2011 |
| Publication date | May 10, 2016 |
| Grant date | May 10, 2016 |
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A device includes one or more reflector components. Each reflector component comprises layer pairs of epitaxially grown reflective layers and layers of a non-epitaxial material, such as air. Vias extend through at least some of the layers of the reflector components. The device may include a light emitting layer.
Opening claim text (preview).
The invention claimed is: 1. A method of making a device, comprising: epitaxially growing a layer stack including one or more reflective layers and one or more interstitial layers, each interstitial layer disposed between two reflective layers; and forming vias that intersect at least some of the one or more reflective layers and the one or more interstitial layers; exposing the interstitial layers to an etchant through the vias; etching the interstitial layers; detecting a color of the surface of the device, a reflectivity of the device, or both a color of the surface of the device and a reflectivity of the device; and controlling the etching based on the detected color, the detected reflectivity, or both the detected color and the detected reflectivity. 2. The method of claim 1 , wherein the one or more reflective layers comprises two sets of one or more reflective layers and further comprising growing a light emitting layer between the sets of reflective layers. 3. The method of claim 1 , wherein growing the layer stack comprises growing only one reflective layer over or under a light emitting layer. 4. The method of claim 1 , wherein: forming the vias comprises dry etching the vias; and exposing the interstitial layers to the etchant comprises exposing the interstitial layers to a wet etchant through the vias. 5. The method of claim 1 , wherein forming the vias comprises forming the vias to surround a central region. 6. The method of claim 1 , wherein the reflective layers and the interstitial layers comprise group III-nitride materials. 7. The method of claim 6 , wherein the reflective layers and the interstitial layers comprise aluminum (Al) and the reflective layers have a lower Al content than the interstitial layers. 8. The method of claim 1 , comprising forming air gaps between the reflective layers. 9. The method of claim 1 , wherein etching the interstitial layers further comprises etching the interstitial layers for a predetermined period of time.
Systems in which incident light is modified in accordance with the properties of the material investigated (where the material investigated is optically excited causing a change in wavelength of the incident light G01N21/63) · CPC title
Structured illumination, e.g. with grating · CPC title
Multilayer mirrors, i.e. having two or more reflecting layers (G02B5/0883, G02B5/0891 take precedence) · CPC title
with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser · CPC title
Refractivity; Phase-affecting properties, e.g. optical path length (G01N21/21 takes precedence) · CPC title
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