Deformation sensor package and method

Patent metadata

Field	Value
Publication number	US-9335225-B2
Application number	US-201314071131-A
Country	US
Kind code	B2
Filing date	Nov 4, 2013
Priority date	Nov 4, 2013
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A deformation sensor package includes a housing having a base and a peripheral wall extending from the base. The base and peripheral wall define two cavities each configured to receive a potentiometer, such as a string potentiometer. The peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing. Each aperture is configured to allow for the passage of a moveable sensing end of an associated potentiometer therethrough.

First claim

What is claimed is:

1. A deformation sensor package comprising:
a housing including:
a base and a peripheral wall extending from the base, the base and peripheral wall defining two cavities, each configured to receive an associated string potentiometer,
wherein the peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing, and wherein each aperture is configured to allow for the passage of a moveable sensing end of a sensing cable of an associated string potentiometer through the aperture.

2. The deformation sensor package of claim 1 , wherein the housing comprises a first housing portion including the base and the peripheral wall and a second housing portion comprising a removable cover for selective enclosing the cavities within the housing.

3. The deformation sensor package of claim 1 , further comprising first and second string potentiometers arranged in a respective one of the cavities defined in the housing.

4. A deformation sensor package comprising:
a housing including:
a base and a peripheral wall extending from the base, the base and peripheral wall defining a first cavity and a second cavity;
a first string potentiometer having a first sensing cable arranged in the first cavity; and
a second string potentiometer having a second sensing cable arranged in the second cavity;
wherein the peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing, and wherein a moveable sensing end of each of the first and second sensing cables is arranged through a respective one of the two apertures.

5. The deformation sensor package of claim 4 , wherein the apertures are sized and oriented such that the sensing cables of the first and second string potentiometers may be attached to a common mounting point on an object for which deformation is to be measured.

6. A system for measuring the deformation of an artificial rib of a crash test dummy comprising:
a sensor package including:
a first string potentiometer and a second string potentiometer, each potentiometer comprising a moveable sensing cable; and
a sensor support structure for positioning first and second potentiometers

at a given distance from a reference point;
an artificial rib of a crash test dummy; and
a processor responsive to outputs of the first and second string potentiometers and configured to measure deformation in response to a force applied to the artificial rib,
wherein each sensing cable of the first and second string potentiometers is attached on a free end thereof to a common deformation measurement location on the artificial rib.

7. The system of claim 6 , further comprising a memory device, the memory device containing data indicative of the locations of the first and second potentiometers with respect to the reference point.

8. The system of claim 6 , wherein the artificial rib comprises a ring-shaped element.

9. The system of claim 8 , wherein the sensor support structure is arranged within the artificial rib and the sensing cables of the first and second potentiometers are attached to a common deformation measurement location positioned on an interior side of the artificial rib.

10. The system of claim 6 , wherein the sensor support structure comprises a housing.

11. The system of claim 10 , wherein an exterior wall of the housing comprises apertures formed therethrough, the apertures configured to allow for the passage of the sensing cables of each potentiometer.

12. The system of claim 6 , further comprising a base, wherein the sensor support structure and the artificial rib are mounted to the base.

13. A method of measuring the deformation of an object with respect to a reference point in at least two dimensions, the method comprising:
arranging first and second string potentiometers at a given distance with respect to a reference point, each string potentiometer comprising a sensing cable having a moveable sensing end;
attaching each of the moveable sensing ends of the first and the second potentiometers to a common deformation measurement location on the object;
determining, in response to a force applied to the object, deformation of the deformation measurement location with respect to the reference point according to the output of the first and second string potentiometers.

14. A method of claim 13 , wherein the step of arranging the first and second potentiometers includes arranging the first and second potentiometers in a housing.

15. A method of measuring the deformation of an object with respect to a reference point in at least two dimensions, the method comprising:
arranging first and second potentiometers at a given distance with respect to a reference point;
attaching moveable sensing ends of the first and the second potentiometers to a common deformation measurement location on the object; and
determining, in response to a force applied to the object, deformation of the deformation measurement location with respect to the reference point according to the output of the first and second potentiometers,
wherein the step of determining deformation of the deformation measurement location with respect to the reference point includes determining the position of the deformation measurement location with respect to the reference point prior to the application of force causing the deformation, and determining the position of the deformation measurement location with respect to the reference point after the application of force causing the deformation.

16. The method of claim 15 , wherein the step of determining deformation of the deformation measurement location with respect to the reference point includes determining a linear deformation component and an angular deformation component with respect to the reference point.

17. The method of claim 13 , further comprising the step of storing the position of the first and second potentiometers with respect to the reference point in the memory of a computer.

18. The method of claim 17 , further comprising the step of storing the position of the common measurement location in the computer according to the output of the first and second potentiometers prior to the application of force causing the deformation.

Assignees

• Measurement Spec Inc

Inventors

• Xu Han
• Chu Anthony S
• Singer Barry A

Classifications

• G01L5/0052

  measuring forces due to impact (G01L5/0061, G01L5/14 take precedence; impact testing of structures G01M7/08; impact testing of material G01N3/00) · CPC title

• G09B23/32

  with moving parts · CPC title

• G01B5/30 Primary

  for measuring the deformation in a solid, e.g. mechanical strain gauge · CPC title

• G01L1/005 Primary

  by electrical means and not provided for in G01L1/06 - G01L1/22 · CPC title