LED lamp

Patent metadata

Field	Value
Publication number	US-9335101-B2
Application number	US-201214110654-A
Country	US
Kind code	B2
Filing date	Apr 11, 2012
Priority date	Apr 11, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

An LED array is thermally coupled to a heat spreader and a heat sink. The heat sink has a base and a plurality of fins extending from the base. Each fin includes a lower portion which extends outwardly from the base and downwardly from the heat spreader, and an upper portion that extends upwardly from the base and is offset from the lower portion so as to form a junction. An aperture may be provided through each junction to allow air to pass therethrough. The heat spreader may also have fins.

First claim

The invention claimed is:

1. A lamp comprising:
a conductive heat spreader having a first surface and a plurality of fins positioned in a first direction from the first surface;
a light emitting diode (LED) array thermally coupled to the first surface; and
a heat sink including a base with a surface and a plurality of fins extending outwardly from the base, a upper portion of the plurality of fins extending in the first direction from the base and a lower portion of the plurality of fins extending in a second direction from the base, wherein thermal channels couple the surface of the base with the lower portion of fins, wherein the heat spreader includes a plurality of apertures therethrough and a plurality of notches therein, each of the notches extending from an edge of the heat spreader to form a plurality of fingers, the apertures and the notches aligning with the thermal channels.

2. The lamp of claim 1 , wherein the plurality of fins of the heat spreader are positioned so as to extend further in the first direction than the plurality of fins of the heat sink.

3. The lamp of claim 2 , wherein the heat sink is formed of a plated plastic.

4. The lamp of claim 1 , further including power conversion circuitry in the base of the heat sink that is potted, the circuitry configured to provide DC power to the LED array.

5. The lamp of claim 4 , further including an Edison base attached to the heat sink, the Edison base electrically isolated from the heat sink and electrically coupled to the power conversion circuitry.

6. A lamp comprising:
a conductive heat spreader having a first surface and a plurality of fins positioned in a first direction from the first surface;
a light emitting diode (LED) array thermally coupled to the first surface; and a heat sink including a base with a surface and a plurality of fins extending outwardly from the base, a upper portion of the plurality of fins extending in the first direction from the base and a lower portion of the plurality of fins extending in a second direction from the base, wherein thermal channels couple the surface of the base with the lower portion of fins, wherein the upper portion of each the fin of the heat sink includes a first section and a second section connected together, the first and second sections being angled relative to each other and relative to the lower portion.

7. The lamp of claim 6 , wherein the first and second sections and the lower portion generally form a Y-shape junction.

8. The lamp of claim 7 , further including an aperture provided through each Y-shaped junction.

9. The lamp of claim 8 , further including a reflector configured direct light emitted from the LED array in the first direction.

Assignees

• Achammer Daniel G
• Mcgowan Daniel B
• Zaderej Victor
• Molex Llc

Inventors

• Achammer Daniel G
• Mcgowan Daniel B
• Zaderej Victor

Classifications

• F21K9/00 Primary

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title

• F21V29/773

  the planes containing the fins or blades having the direction of the light emitting axis · CPC title

• F21V29/713

  in direct thermal and mechanical contact of each other to form a single system · CPC title

• F21K9/50

  Mechanical Engineering · mapped topic

• F21K9/137

  Mechanical Engineering · mapped topic