Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer

Patent metadata

Field	Value
Publication number	US-9334424-B2
Application number	US-201313868622-A
Country	US
Kind code	B2
Filing date	Apr 23, 2013
Priority date	May 8, 2012
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R 21 R 22 R 23 SiO 1/2 , and a SiO 4/2 unit in a molar ratio of R 21 R 22 R 23 SiO 1/2 unit/SiO 4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.

First claim

What is claimed is:

1. A temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, comprising a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R 21 R 22 R 23 SiO 1/2 unit, wherein R 21 , R 22 , and R 23 represent each a substituted or an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydroxyl group, and a SiO 4/2 unit in a molar ratio of R 21 R 22 R 23 SiO 1/2 unit/SiO 4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support,

wherein R 11 and R 12 represent each a substituted or an unsubstituted monovalent hydrocarbon group having to 10 carbon atoms and “n” represents 5,000 to 10,000.

2. The temporary adhesive for wafer processing according to claim 1 , wherein the ratio of the organopolysiloxane to the organopolysiloxane resin, which are dehydrated and condensed, in the thermoplastic resin modified organopolysiloxane layer (A) is 99:1 to 50:50, and the weight average molecular weight of is 400,000 to 1,500,000.

3. The temporary adhesive for wafer processing according to claim 1 , wherein the thermosetting modified siloxane polymer layer (B) is a thermosetting layer of a composition containing 0.1 to 50 parts by mass of one or more kinds selected from an amino condensate modified by formalin or formalin alcohol, a melamine resin, a urea resin, a phenol compound having two or more methylol groups or alkoxymethylol groups on the average per molecule, and an epoxy compound having two or more epoxy groups on the average per molecule, relative to 100 parts by mass of thermosetting modified siloxane polymer including a silphenylene-containing polymer having a repeating unit represented by the following general formula (2) and a weight average molecular weight of 3,000 to 500,000 or an epoxy group-containing silicone polymer having a repeating unit represented by the following general formula (4) and a weight average molecular weight of 3,000 to 500,000,

wherein R 1 to R 4 represent each a monovalent hydrocarbon group having 1 to 8 carbon atoms and may be the same or different; “m” represents an integer of 1 or 100; A represents a positive number; B represents 0 or a positive number; and X represents a divalent organic group represented by the following general formula (3),

wherein Z represents a divalent organic group selected from

“n” represents 0 or 1; R 5 and R 6 represent each an alkyl group or an alkoxy group having 1 to 4 carbon atoms and may be the same or different from each other; and “k” represents 0, 1, or 2,

wherein R 1 to R 4 represent each a monovalent hydrocarbon group having 1 to 8 carbon atoms and may be the same or different; m represents an integer of 1 or 100; “a”, “b”, “c”, and “d” represent each 0 or a positive number, wherein “c” and “d” are not 0 simultaneously and they satisfy 0<(c+d)/(a+b+c+d)≦1.0; X represents a divalent organic group represented by the following general formula (3); and Y represents a divalent organic group represented by the following general formula (5),

wherein Z represents a divalent organic group selected from

“n” represents 0 or 1; R 5 and R 6 represent each an alkyl group or an alkoxy group having 1 to 4 carbon atoms and may be the same or different from each other; and “k” represents 0, 1, or 2,

wherein V represents a divalent organic group selected from

“p” represents 0 or 1; R 7 and R 8 represent each an alkyl group or an alkoxy group having 1 to 4 carbon atoms and may be the same or different from each other; and “h” represents 0, 1, or 2.

4. The temporary adhesive for wafer processing according to claim 2 , wherein the thermosetting modified siloxane polymer layer (B) is a thermosetting layer of a composition containing 0.1 to 50 parts by mass of one or more kinds selected from an amino condensate modified by formalin or formalin alcohol, a melamine resin, a urea resin, a phenol compound having two or more methylol groups or alkoxymethylol groups on the average per molecule, and an epoxy compound having two or more epoxy groups on the average per molecule, relative to 100 parts by mass of thermosetting modified siloxane polymer including a silphenylene-containing polymer having a repeating unit represented by the following general formula (2) and a weight average molecular weight of 3,000 to 500,000 or an epoxy group-containing silicone polymer having a repeating unit represented by the following general formula (4) and a weight average molecular weight of 3,000 to 500,000,

wherein R 1 to R 4 represent each a monovalent hydrocarbon group having 1 to 8 carbon atoms and may be the same or different; “m” represents an integer of 1 or 100; A represents a positive number; B represents 0 or a positive number; and X represents a divalent organic group represented by the following general formula (3),

wherein Z represents a divalent organic group selected from

“n” represents 0 or 1; R 5 and R 6 represent each an alkyl group or an alkoxy group having 1 to 4 carbon atoms and may be the same or different from each other; and “k” represents 0, 1, or 2,

wherein R 1 to R 4 represent each a monovalent hydrocarbon group having 1 to 8 carbon atoms and may be the same or different; m represents an integer of 1 or 100; “a”, “b”, “c”, and “d” represent each 0 or a positive number, wherein “c” and “d” are not 0 simultaneously and they satisfy 0<(c+d)/(a+b+c+d)≦1.0; X represents a divalent organic group represented by the following general formula (3); and Y represents a divalent organic group represented by the following general formula (5),

wherein Z represents a divalent organic group selected from

“n” represents 0 or 1; R 5 and R 6 represent each an alkyl group or an alkoxy group having 1 to 4 carbon atoms and may be the same or d

Assignees

• Shinetsu Chemical Co

Inventors

• Tanabe Masahito
• Sugo Michihiro
• Tagami Shohei
• Yasuda Hiroyuki
• Kato Hideto

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title