Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the same

US9333467B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9333467-B2
Application numberUS-201414301823-A
CountryUS
Kind codeB2
Filing dateJun 11, 2014
Priority dateJun 12, 2013
Publication dateMay 10, 2016
Grant dateMay 10, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for manufacturing a polishing pad, the apparatus comprising: a housing including a body, an interconnection portion, and a discharging portion; and a stirrer to mix a polishing pad composition and a pore forming material with each other, the stirrer being located in the housing, wherein a diameter of the discharging portion is in a range of about 9 mm to about 16 mm. 2. The apparatus as claimed in claim 1 , wherein the discharging portion discharges the polishing pad composition mixed with the pore forming material at a velocity of about 10 kgf/min to about 30 kgf/min through the discharging portion. 3. The apparatus as claimed in claim 1 , wherein the discharging portion includes polyvinyl chloride (PVC). 4. The apparatus as claimed in claim 1 , further comprising: a drying container facing the discharging portion and spaced apart from the discharging portion. 5. The apparatus as claimed in claim 1 , further comprising: a heating part that increases a temperature of the polishing pad composition and the pore forming material in the housing. 6. The apparatus as claimed in claim 1 , wherein the polishing pad composition includes at least one selected from the group of a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyvinylchloride resin, a polyamide resin, an acryl resin, a polyurethane resin, a polycarbonate resin, a phenol resin, an amino resin, an epoxy resin, a polyester resin, rubber, acrylonitrile butadiene styrene (ABS), and a styrene acrylonitrile copolymer (SAN). 7. The apparatus as claimed in claim 1 , wherein the pore forming material includes an inert gas, an encapsulating blowing agent, and/or a chemical blowing agent. 8. A method of manufacturing a polishing pad, the method comprising: providing a polishing pad composition and a pore forming material in a mixing chamber; mixing the polishing pad composition and the pore forming material by a stirrer of the mixing chamber to form pores in the polishing pad composition; discharging the polishing pad composition including the pores from the mixing chamber through a discharging portion of the mixing chamber at a velocity of about 10 kgf/min to about 30 kgf/min; drying the discharged polishing pad composition including the pores to form a polishing pad mold; and cutting the polishing pad mold to form polishing pads. 9. The method as claimed in claim 8 , wherein a diameter of the discharging portion is in the range of about 9 mm to about 16 mm. 10. The method as claimed in claim 8 , wherein the mixing chamber is heated at a temperature of about 70° C. to about 85° C. 11. The method as claimed in claim 8 , wherein a portion of the pore forming material remains in the polishing pad composition discharged through the discharging portion such that the remaining pore forming material additionally generates pores in the discharged polishing pad composition. 12. An apparatus for manufacturing a polishing pad, the apparatus comprising: a housing including a body, an interconnection portion, and a discharging portion; and a drying container spaced apart from and facing the discharging portion, the discharging portion of the housing being configured to discharge a mixture of a polishing pad composition and a pore forming material from the housing to the drying container at a velocity of about 10 kgf/min to about 30 kgf/min. 13. The apparatus as claimed in claim 12 , wherein a diameter of the discharging portion is in a range of about 9 mm to about 16 mm. 14. The apparatus as claimed in claim 12 , wherein the housing includes a stirrer located in the housing, the stirrer mixing the polishing pad composition and the pore forming material with each other in the housing to form the mixture of the polishing pad composition and the pore forming material. 15. The apparatus as claimed in claim 14 , further including a heater that heats the mixture of the polishing pad composition and the pore forming material in the housing.

Assignees

Inventors

Classifications

  • characterised by the composition or properties of the pad materials · CPC title

  • Operations & Transport · mapped topic

  • Operations & Transport · mapped topic

  • Manufacture of grinding tools {or other grinding devices}, e.g. wheels, not otherwise provided for · CPC title

  • Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US9333467B2 cover?
An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification B01F7/00491. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 10 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).