Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles

Patent metadata

Field	Value
Publication number	US-9333337-B2
Application number	US-201214118183-A
Country	US
Kind code	B2
Filing date	May 16, 2012
Priority date	May 16, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.

First claim

We claim:

1. A method of fabricating electrical feedthroughs, comprising:
coating each of a plurality of electrically conductive wires with an electrically insulating material;
bundling the coated wires together in a substantially parallel arrangement;
fixedly securing the bundled coated wires to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block; and
cutting the monolithic block transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending therebetween,
wherein the bundled coated wires are fixedly secured as a randomly-ordered array not having a geometrically repeating cross-sectional pattern.

2. The method of claim 1 ,
wherein the electrically conductive wires are a bio-compatible metal.

3. The method of claim 1 ,
wherein the electrically insulating material is selected from the group consisting of glass, polymer, ceramic, and other dielectric materials.

4. The method of claim 1 ,
wherein the electrically insulating material is a bio-compatible material.

5. The method of claim 1 ,
further comprising forming a first electrically conductive contact pad on the first side of the block section to contact a first end of at least two of the wires, and a second electrically conductive contact pad on the second side of the block section to contact an opposite second end of the same wires.

6. The method of claim 1 ,
wherein the coated wires are bundled together with a ring-like structure surrounding the coated wires.

7. The method of claim 1 ,
wherein the electrically insulating material of adjacent wires are joined together by being heated at elevated temperatures.

8. An electrical feedthrough substrate, comprising:
a substrate block having opposing first and second sides with a plurality of electrically conductive wires extending therebetween, wherein said electrically conductive wires are each insulated with an electrically insulating material that is joined with electrically insulating material of adjacent wires to fixedly secure the wires together in a substantially parallel arrangement without any gaps therebetween,
wherein the electrically conductive wires are arranged in a randomly-ordered array not having a geometrically repeating cross-sectional pattern.

9. The electrical feedthrough substrate of claim 8 ,
wherein the electrically conductive wires are a bio-compatible metal.

10. The electrical feedthrough substrate of claim 8 ,
wherein the electrically insulating material is selected from the group consisting of glass, polymer, ceramic, and other dielectric materials.

11. The electrical feedthrough substrate of claim 8 ,
wherein the electrically insulating material is a bio-compatible material.

12. The electrical feedthrough substrate of claim 8 ,
further comprising a first electrically conductive contact pad on the first side of the substrate block contacting a first end of at least two of the wires, and a second electrically conductive contact pad on the second side of the substrate block contacting an opposite second end of the same wires.

13. The electrical feedthrough substrate of claim 8 ,
wherein the substrate block includes a ring-like structure surrounding the plurality of electrically conductive wires and joined electrically insulating material.

Assignees

• Shah Kedar G
• Benett William J
• Pannu Satinderpall S
• L Livermore Nat Security Llc

Inventors

• Shah Kedar G
• Benett William J
• Pannu Satinderpall S

Classifications

• H01B13/0036

  Details · CPC title

• H02G3/22

  Installations of cables or lines through walls, floors or ceilings, e.g. into buildings · CPC title

• Y10T29/49194

  Assembling elongated conductors, e.g., splicing, etc. · CPC title

• A61N1/05 Primary

  for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

• H01B17/303 Primary

  Sealing of leads to lead-through insulators · CPC title