Insulation circuit and communication equipment

Patent metadata

Field	Value
Publication number	US-9332630-B2
Application number	US-201214374596-A
Country	US
Kind code	B2
Filing date	Oct 9, 2012
Priority date	Feb 2, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.

First claim

The invention claimed is:

1. An insulation circuit comprising:
a first pattern formed on a first layer of a board and receiving an RF signal;
a second pattern formed on the first layer next to the first pattern, the second pattern outputting the RF signal received by the first pattern;
a third pattern formed on a second layer different from the first layer of the board so as to overlap the first and second patterns respectively when seen in a plan view manner, the third pattern connecting to a signal ground; and
a fourth pattern formed on the second layer next to the third pattern so as to overlap the first and second patterns respectively when seen in a plan view manner, the fourth pattern connecting to a frame ground.

2. The insulation circuit according to claim 1 , wherein
the third pattern has at least one first aperture part formed along at least one side of the overlapping part with the second pattern when seen in plan view manner; and
the fourth pattern has at least one second aperture part formed along at least one side of the overlapping part with the first pattern when seen in plan view manner.

3. The insulation circuit according to claim 2 , wherein
the first aperture part is formed along both sides of the overlapping part of the second and third patterns; and
the second aperture part is formed along both sides of the overlapping part of the first and fourth patterns.

4. The insulation circuit according to claim 2 , wherein
the first aperture part is formed along one side of the overlapping part of the second and third patterns.

5. The insulation circuit according to claim 2 , wherein
the second aperture part is formed along one side of the overlapping part of the first and fourth patterns.

6. The insulation circuit according to claim 1 , wherein
a first slit extending in the direction in which the first and second patterns extend is formed in the third pattern, when seen in plan view manner, between the overlapping part with the first pattern and the overlapping part with the second pattern; and
a second slit extending in the direction in which the first and second patterns extend is formed in the fourth pattern, when seen in plan view manner, between the overlapping part with the first pattern and the overlapping part with the second pattern.

7. The insulation circuit according to claim 1 further comprising:
a fifth pattern formed on the first layer so as to overlap with the third pattern when seen in plan view manner, one end of the fifth pattern being connected to the first pattern, the other end of the fifth pattern being connected to the third pattern through a first via; and
a sixth pattern formed on the first layer so as to overlap with the fourth pattern when seen in plan view manner, one end of the sixth pattern being connected to the second pattern, the other end of the sixth pattern being connected to the fourth pattern through a second via.

8. The insulation circuit according to claim 1 , wherein the third and fourth patterns are separated by at least a distance within the second layer that corresponds to intrinsic safety and explosion-proofness.

9. The insulation circuit according to claim 1 , wherein the board is a double-sided board on which patterns are formed on the first layer that is a front surface and on the second layer that is a rear surface.

10. The insulation circuit according to claim 1 , wherein the board is a multilayer board providing at least one layer in which patterns are formed between the front surface and the rear surface.

11. The insulation circuit according to claim 1 , wherein a board having a prescribed thickness is interposed between the first and second patterns and the third and fourth patterns.

12. The insulation circuit according to claim 1 , wherein the first and second patterns are straight-line shapes and have a plurality of pads for impedance matching.

13. The insulation circuit according to claim 1 , wherein one end of the first and second patterns have pre-established characteristic impedances and the other ends thereof are open ends.

14. The communication equipment performing at least one of transmission and reception of an RF signal; the communication equipment comprising:
an insulation circuit comprising:
a first pattern formed on a first layer of a board and receiving the RF signal;
a second pattern formed on the first layer next to the first pattern and outputting the RF signal received by the first pattern;
a third pattern formed on a second layer different from the first layer of the board so as to overlap the first and second patterns respectively when seen in a plan view manner and connecting to a signal ground; and
a fourth pattern formed on the second layer next to the third pattern so as to overlap the first and second patterns respectively when seen in a plan view manner and connecting to a frame ground, wherein

a signal line in which the RF signal is transmitted is connected to the first and second patterns and the signal ground and the frame ground are DC-insulated.

15. The communication equipment according to the claim 14 , wherein
a first slit that is extending in the direction in which the first and second patterns are extending is formed in the third pattern, when seen in plan view manner, between the overlapping part with the first pattern and the overlapping part with the second pattern; and
a second slit that is extending in the direction in which the first and second patterns are extending is formed in the fourth pattern, when seen in plan view manner, between the overlapping part with the first pattern and the overlapping part with the second pattern.

16. The communication equipment according to claim 14 , wherein
the third pattern has at least one first aperture part formed along at least one side of the overlapping part with the second pattern when seen in plan view manner; and
the fourth pattern has at least one second aperture part formed along at least one side of the overlapping part with the first pattern when seen in plan view manner.

17. The communication equipment according to claim 14 , wherein the insulation circuit further comprising:
a fifth pattern formed on the first layer so as to overlap with the third pattern when seen in plan view manner, one end of the fifth pattern being connected to the first pattern, the other end of the fifth pattern being connected to the third pattern through a first via; and
a sixth pattern formed on the first layer so as to overlap with the fourth pattern when seen in plan view manner, one end of the sixth pattern being connected to the second pattern, the other end of the sixth pattern being connected to the fourth pattern through a second via.

18. The communication equipment according to claim 14 , wherein the third and fourth patterns are separated by at least a distance within the second layer that corresponds to intrinsic safety and explosion-proofness.

Assignees

• Yokogawa Electric Corp

Inventors

• Mochizuki Satoshi
• Takeuchi Makoto

Classifications

• H01P1/203

  Strip line filters · CPC title

• H01P5/00

  Coupling devices of the waveguide type · CPC title

• H05K1/0227

  Split or nearly split shielding or ground planes · CPC title

• H05K1/0225

  Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence) · CPC title

• H01P1/20

  Frequency-selective devices, e.g. filters · CPC title