Transmitter optical module implemented with thermo-electric controller

Patent metadata

Field	Value
Publication number	US-9331789-B2
Application number	US-201314075876-A
Country	US
Kind code	B2
Filing date	Nov 8, 2013
Priority date	Nov 8, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A transmitter optical module is disclosed. The optical module includes a plurality of LDs each emitting light with specific wavelengths different from others, a TEC including a post in bottom plate thereof through which currents to driver the TEC is supplied, and a body portion including an electrical plug made of multi-layered ceramics. The multi-layered ceramic in a lowermost ceramic layer thereof provides electrical pads to supply current to the TEC through the post. The post and the pads are configured in side-by-side arrangement such that the post in the TEC is put between two pads in the lowermost ceramic layer.

First claim

What is claimed is:

1. A transmitter optical module, comprising:
a semiconductor laser diode (LD) to emit light with a specific wavelength;
a thermo-electric-controller (TEC) to control a temperature of the (LD), the TEC including a bottom plate and a post provided on the bottom plate; and
a body portion configured to enclose the LD and the TEC therein hermetically, the body portion including an electrical plug made of multi-layered ceramics including a lowermost layer providing an electrical pad on a top surface thereof exposed within the body portion, the electrical pad supplying a current to the TEC through the post,
wherein the post and the electrical pad are configured in side-by-side arrangement and electrically connected with a bonding wire,
wherein the multi-layered ceramics of the electrical plug further includes a first ceramic layer providing an interconnection electrically connecting an inside of the body portion to an outside thereof, the interconnection of the first layer providing an electrical pad in an end outside of the body portion.

2. The transmitter optical module of claim 1 ,
wherein the bottom plate of the TEC is slipped under the lowermost layer of the multi-layered ceramics of the electrical plug.

3. The transmitter optical module of claim 1 ,
wherein the post on the bottom plate of the TEC has a level lower than a level of the top surface of the lowermost layer exposed within the body portion.

4. The transmitter optical module of claim 1 ,
wherein the first ceramic layer provides interconnections in a top surface and a back surface thereof, the electric pad on the top surface of the lowermost ceramic layer exposed within the body portion being electrically connected to the interconnection in the back surface of the first ceramic layer.

5. The transmitter optical module of claim 1 ,
wherein the bonding wire has a top level lower than a top level of the TEC.

6. A transmitter optical module, comprising:
a plurality of laser diodes (LDs) each emitting light having wavelengths different from each other;
a thermo-electric-controller (TEC) to control a temperature of the LDs, the TEC including a bottom plate and a post provided on the bottom plate;
a body portion configured to enclose the LDs and the TEC therein hermetically, the body portion including an electrical plug made of multi-layered ceramics including an electrical pad that supplies a current to the TEC through the post, the electrical pad being arranged side-by-side with respect to the post of the TEC;
a driver for driving the LDs electrically; and
an optical multiplexer that multiplexes the light emitted from the LDs,
wherein the LDs and the driver are installed on the IBC through a first carrier, and the optical multiplexer is installed on the TEC through a second carrier different from the first carrier.

7. The transmitter optical module of claim 6 ,
further including a wiring substrate provided on the first carrier, the wiring substrate providing an interconnection electrically connected to the driver.

8. The transmitter optical module of claim 7 ,
wherein the wiring substrate extends outwardly from an edge of the first carrier to the electrical plug.

9. The transmitter optical module of claim 6 ,
wherein the TEC provides a top plate, the first carrier extending outwardly from an edge of a top plate of the TEC toward the plug.

10. The transmitter optical module of claim 6 ,
wherein the multi-layered ceramics of the electrical plug includes a lowermost layer and a first ceramic layer on the lowermost layer, the electrical pad being provided on a top surface of a portion of the lowermost layer exposed from the first ceramic layer, and
wherein the first ceramic layer provides an interconnection electrically connecting an inside of the body portion to an outside thereof, the interconnection of the first ceramic layer providing an electrical pad in an end outside of the body portion.

11. The transmitter optical module of claim 10 ,
wherein the first ceramic layer forms exposed areas in respective sides of the lowermost layer by exposing the top surface of the lowermost ceramic layer, and
wherein the post provided on the bottom plate of the TEC is put between the exposed areas in the respective sides of the top surface of the lowermost ceramic layer exposed by the first ceramic layer.

12. The transmitter optical module of claim 6 ,
wherein the bonding wire has a top level lower than a top level of the TEC.

13. A transmitter optical module, comprising:
a semiconductor laser diode (LD) configured to emit light with a specific wavelength;
a thermo-electric-controller (TEC) configured to control a temperature of the LD, the TEC including a bottom plate and a post provided on the bottom plate thereof;
a body portion configured to enclose the LD and the TEC therein hermetically, the body portion including an electrical plug made of multi-layered ceramics including an electrical pad that supplies a current to the TEC through the post; and
a coupling portion assembled with one side of the body portion opposite to a side where the electrical plug is formed,
wherein the post and the pad are configured in side-by-side arrangement and electrically connected with a bonding wire, and
wherein the body portion provides no electrical structures in both sides connecting the side where the coupling portion is assembled to the side where the electrical plug is formed.

Assignees

• Sumitomo Electric Industries

Inventors

• Sato Shunsuke

Classifications

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• H04B10/50 Primary

  Transmitters · CPC title

• G02B6/4215

  the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers (G02B6/4246 takes precedence) · CPC title

• G02B6/4271

  with thermo electric cooling · CPC title