Conductive path structure and wire harness

Patent metadata

Field	Value
Publication number	US-9330813-B2
Application number	US-201113819029-A
Country	US
Kind code	B2
Filing date	Sep 6, 2011
Priority date	Sep 6, 2010
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, a first covering member that covers the first conductive portion and the cut-off facilitating portion, and a second covering member that covers the second conductive portion and the cut-off facilitating portion. The second covering member covers the cut-off facilitating portion through the first covering member. The second covering member slidably covers the first covering member.

First claim

The invention claimed is:

1. A conductive path structure comprising: a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, the first conductive portion, the second conductive portion, and the cut-off facilitating portion forming a single conductive member, wherein a cross-sectional area of the cut-off facilitating member is smaller than a cross-sectional area of the first conductive portion and the second conductive portion; a first covering member that covers the first conductive portion and the cut-off facilitating portion; and a second covering member that covers the second conductive portion and the cut-off facilitating portion, wherein the second covering member covers the cut-off facilitating portion through the first covering member; wherein the second covering member slidably covers the first covering member; and wherein the cut-off facilitating portion is configured to separate the first conductive portion and the second conductive portion when a sufficient force is applied to the conductive path structure.

2. The conductive path structure according to claim 1 , wherein the second covering member covers the cut-off facilitating portion through a gap;
and wherein the first covering member is arranged so as to be inserted into the gap.

3. The conductive path structure according to claim 1 , wherein the first covering member directly covers the cut-off facilitating portion.

4. The conductive path structure according to claim 1 , wherein a material of the first covering member is different from a material of the second covering member.

5. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a groove is formed.

6. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a notch is formed.

7. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor in which a through hole is formed.

8. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor having a thin portion thinner than the first and second conductive portions.

9. A wire harness including a plurality of conductive paths each having the conductive path structure according to claim 1 .

10. The conductive path structure according to claim 1 , wherein the conductor is formed such that the first conductive portion and the second conductive portion are connected as a single conductor.

11. The conductive path structure according to claim 1 , wherein the single conductive member is a flat metal plate.

12. A conductive path structure comprising:
a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating means for separating the first conductive portion from the second conductive portion when a sufficient force is applied to the conductive path structure;
a first covering member that covers the first conductive portion and the cut-off facilitating means; and
a second covering member that covers the second conductive portion and the cut-off facilitating means,
wherein the second covering member covers the cut-off facilitating means through the first covering member;
wherein the second covering member slidably covers the first covering member.

13. A conductive path structure comprising:
a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion;
a first covering member that covers the first conductive portion and the cut-off facilitating portion;
a second covering member that covers the second conductive portion and the cut-off facilitating portion; and
a tolerance absorption portion formed on the first conductive portion having a slit extending in a direction approximately intersecting the conductor width direction,
wherein the second covering member covers the cut-off facilitating portion through the first covering member;
wherein the second covering member slidably covers the first covering member; and
wherein the cut-off facilitating portion is configured to separate the first conductive portion and the second conductive portion when a sufficient force is applied to the conductive path structure.

Assignees

• Adachi Hideomi
• Kuboshima Hidehiko
• Yazaki Corp

Inventors

• Adachi Hideomi
• Kuboshima Hidehiko

Classifications

• H01B7/009 Primary

  Cables with built-in connecting points or with predetermined areas for making deviations · CPC title

• H01R31/06

  Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) · CPC title

• H01R13/53

  Bases or cases for heavy duty; Bases or cases {for high voltage} with means for preventing corona or arcing · CPC title

• H01R13/504 Primary

  different pieces being moulded, cemented, welded, e.g. ultrasonic welding, or swaged together · CPC title