MEMS tilt sensor

Patent metadata

Field	Value
Publication number	US-9329199-B2
Application number	US-201213705722-A
Country	US
Kind code	B2
Filing date	Dec 5, 2012
Priority date	Dec 6, 2011
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.

First claim

What is claimed is:

1. An acoustic apparatus, the apparatus comprising:
a back plate that is selectively charged, the back plate having a plurality of openings extending therethrough;
at least one back plate electrode coupled to the back plate;
a proof of mass, the proof of mass elastically coupled to and hanging from the back plate in a vertical position;
a proof of mass electrode coupled to the proof of mass;
wherein movement of the apparatus causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary, the capacitance representing a magnitude of the movement of the apparatus;
wherein movement of the apparatus causes a tilt of the back plate while the proof of mass substantially maintains the vertical position.

2. The apparatus of claim 1 wherein the proof of mass is coupled to the back plate via a spring.

3. The apparatus of claim 1 wherein the proof of mass is generally cylindrical in shape.

4. The apparatus of claim 1 wherein the proof of mass has a configuration selected from the group consisting of: a hollow configuration and a solid configuration.

5. The apparatus of claim 1 wherein the capacitance represents at least one of a pitch of the back plate, a roll of the back plate, or a yaw of the back plate.

6. The apparatus of claim 1 wherein the apparatus is disposed in a device, the device selected from the group consisting of a personal computer, a cellular phone, a personal music player, a digital still camera, a digital video camera, a voice recorder, and a remote control unit.

7. The apparatus of claim 1 wherein the capacitance is transmitted to an application program.

8. An microphone assembly comprising:
a substrate;
a housing coupled to the substrate;
a MEMS microphone disposed on the substrate and enclosed in the housing;
an integrated circuit disposed on the substrate, enclosed in the housing, and coupled to the MEMS microphone;
a tilt sensor disposed on the substrate, enclosed in the housing, and coupled to the integrated circuit, the tilt sensor comprising:
a back plate that is selectively charged, the back plate having a plurality of openings extending therethrough;
at least one back plate electrode coupled to the back plate;
a proof of mass, the proof of mass elastically coupled to and hanging from the back plate in a vertical position;
a proof of mass electrode coupled to the proof of mass;
wherein movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary, the capacitance representing a magnitude of the movement of the sensor;
wherein movement of the sensor causes a tilt of the back plate while the proof of mass substantially maintains the vertical position,

wherein the capacitance is communicated to the integrated circuit for further processing.

9. The microphone assembly of claim 8 wherein the proof of mass is coupled to the back plate via a spring.

10. The microphone assembly of claim 8 wherein the proof of mass is generally cylindrical in shape.

11. The microphone assembly of claim 8 wherein the proof of mass has a configuration selected from the group consisting of: a hollow configuration and a solid configuration.

12. The microphone assembly of claim 8 wherein the capacitance represents at least one of a pitch of the back plate, a roll of the back plate, or a yaw of the back plate.

Assignees

• Knowles Electronics Llc

Inventors

• Lee Sung Bok
• Lautenschlager Eric J

Classifications

• H04R2307/025

  Diaphragms comprising polymeric materials · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R3/00

  Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title

• G01P2015/0822

  for defining out-of-plane movement of the mass · CPC title