Two-pack type epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material

Patent metadata

Field	Value
Publication number	US-9328237-B2
Application number	US-201214352342-A
Country	US
Kind code	B2
Filing date	Oct 23, 2012
Priority date	Oct 31, 2011
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.

First claim

The invention claimed is:

1. A fiber-reinforced composite material produced by combining a two-pack epoxy resin composition comprising a two-pack epoxy resin composition for fiber-reinforced composite materials comprising components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and [C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule, which has a mass mixing ratio between components [B] and [C] of 95:5 to 86:14;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack with reinforcing fibers and curing the composition.

2. The fiber-reinforced composite material according to claim 1 , where the reinforcing fibers are carbon fiber.

3. A fiber-reinforced composite material produced by combining a two-pack epoxy resin composition with reinforcing fibers and curing the composition, wherein the two-pack epoxy resin composition comprises components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and
[C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack and the two-pack epoxy resin composition has a viscosity at 25° C. of 0.1 to 2.5 Pa·s.

4. A fiber-reinforced composite material produced by combining a two-pack epoxy resin composition with reinforcing fibers and curing the composition, wherein the two-pack epoxy resin composition comprises components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and
[C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack and wherein the component [C] is a phenol novolac with a softening point of 100° C. or less or a cresol novolac with a softening point of 100° C. or less.

5. A fiber-reinforced composite material produced by combining a two-pack epoxy resin composition with reinforcing fibers and curing the composition, wherein the two-pack epoxy resin composition comprises components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and
[C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule which has a mass mixing ratio between components [B] and [C] of 95:5 to 81:19;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack.

6. A two-pack epoxy resin composition for fiber-reinforced composite materials comprising components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and [C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule, which has a mass mixing ratio between components [B] and [C] of 95:5 to 86:14;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack, and the composition has a viscosity at 25° C. of 0.1 to 2.5 Pa·s.

7. The two-pack epoxy resin composition according to claim 6 , wherein component [A] is a bisphenol epoxy resin.

8. The two-pack epoxy resin composition according to claim 6 , wherein component [B] is an acid anhydride having an alicyclic structure.

9. The two-pack epoxy resin composition according to claim 6 , wherein the component [C] is a phenol novolac with a softening point of 100° C. or less or a cresol novolac with a softening point of 100° C. or less.

10. A two-pack epoxy resin composition for fiber-reinforced composite materials comprising components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less:
a base resin pack containing component [A] an epoxy resin; and
a curing agent pack containing components [B] an acid anhydride and [C] a compound having an average of 2.5 or more hydroxyphenyl structures in each molecule, which has a mass mixing ratio between components [B] and [C] of 95:5 to 86:14;
wherein component [D] an organic phosphorus compound or imidazole derivative is blended into either the base resin pack or the curing agent pack and the composition is obtained by mixing a base resin pack mixing comprising component [A] and a curing agent pack comprising components [B], [C] and [D], and the curing agent pack has a viscosity at 25° C. of 0.05 to 1.8 Pa·s.

Assignees

• Toray Industries

Inventors

• Oka Hideki
• Tomioka Nobuyuki
• Honda Shirou

Classifications

• C08J5/04

  Reinforcing macromolecular compounds with loose or coherent fibrous material · CPC title

• C08G59/686

  containing nitrogen · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• C08G59/4284

  together with other curing agents · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title