Surface-modified glass substrate

Patent metadata

Field	Value
Publication number	US-9328016-B2
Application number	US-201314043282-A
Country	US
Kind code	B2
Filing date	Oct 1, 2013
Priority date	Oct 3, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Scratch-resistant glass substrates including a hard, scratch-resistant layer over a major surface of the substrate are disclosed. The layer may exhibit a hardness, as measured using a Berkovich indenter, of at least 10 GPa and an x-ray amorphous structure along at least a portion of the thickness of the layer. The layer may optionally exhibit an optical transparency of at least 70% and/or a compressive stress of at least 10 MPa.

First claim

What is claimed is:

1. An electronic device housing, comprising:
at least one of (a) a front glass cover placed and secured to provide a front surface for the electronic device enclosure, and (b) a back glass cover placed and secured to provide a back surface for the electronic device enclosure, wherein the front glass cover and the back glass cover comprise a glass substrate,
wherein the glass substrate comprises:
a glass main body having opposing major surfaces; and
a layer having a thickness provided over a majority of a first major surface, wherein at least a portion of the thickness of the layer comprises a Berkovich indenter hardness of at least 10 GPa and an x-ray amorphous structure, and wherein the layer comprises at least one attribute selected from the group consisting of:
an optical transparency of at least 70%; and
a compressive stress of at least 10 MPa.

2. The electronic device housing according to claim 1 , wherein the layer comprises both attributes selected from the group.

3. The electronic device housing according to claim 1 , wherein the layer comprises a Berkovich indenter hardness ranging from 10 GPa to 30 GPa.

4. The electronic device housing according to claim 1 , wherein the layer has an optical transparency ranging from 70% to 90%.

5. The electronic device housing according to claim 1 , wherein the thickness of the layer is in the range from about 50 nm to about 200 nm.

6. The electronic device housing according to claim 1 , wherein the thickness of the layer is in the range from about 50 nm to about 2 μm.

7. The electronic device housing according to claim 1 , wherein the layer has a compressive stress ranging from 10 MPa to 500 MPa.

8. The electronic device housing according to claim 1 , wherein the layer has a crystalline fraction of about 20 vol. % or less.

9. The electronic device housing according to claim 8 , wherein the layer is substantially free of any crystalline fraction.

10. The electronic device housing according to claim 1 , wherein the layer is a contiguous layer.

11. The electronic device housing according to claim 1 , wherein the layer is provided in direct physical contact with the glass substrate.

12. The electronic device housing according to claim 1 , wherein one or more of an anti-reflective layer, anti-sparkle layer, anti-glare layer and an adhesion-promoting layer are provided between the glass substrate and the layer.

13. The electronic device housing according to claim 1 , wherein the layer has a refractive index of less than about 3 at visible wavelengths.

14. The electronic device housing according to claim 1 , wherein the layer has a refractive index between about 1.7 and 2.8 at visible wavelengths.

15. The electronic device housing according to claim 1 , wherein the layer has a reflectance of less than about 40% at visible wavelengths.

16. The electronic device housing according to claim 1 , wherein the layer is water clear.

17. The electronic device housing according to claim 1 , where the layer is substantially free of micro ductile scratches.

18. The electronic device housing according to claim 1 , wherein the glass substrate has a thickness ranging from about 100 microns to 5 mm.

19. The electronic device housing according to claim 1 , wherein the glass substrate comprises chemically-strengthened glass.

20. The electronic device housing according to claim 1 , wherein the layer comprises a metal oxide, a metal nitride, a metal carbide, a metal boride, diamond-like carbon or a combination thereof.

21. The electronic device housing according to claim 19 , wherein the metal is selected from the group consisting of B, Al, Si, Ti, V, Cr, Y, Zr, Nb, Mo, Sn, Hf, Ta and W.

22. An electronic device housing, comprising:
at least one of (a) a front glass cover placed and secured to provide a front surface for the electronic device enclosure, and (b) a back glass cover placed and secured to provide a back surface for the electronic device enclosure, wherein the front glass cover and the back glass cover comprise a glass substrate,
wherein the glass substrate comprises:
a glass main body having opposing major surfaces; and
a layer having a thickness provided over a majority of a first major surface, wherein at least a portion of the thickness of the layer comprises a Berkovich indenter hardness of at least 10 GPa and an x-ray amorphous structure, and
wherein the glass substrate exhibits a scratch width reduction, when scratched using a Berkovich indenter and a load of at least 60 mN, of at least 35%, when compared to a glass main body without the layer provided over a majority of a first major surface.

23. An electronic device housing, comprising:
at least one of (a) a front glass cover placed and secured to provide a front surface for the electronic device enclosure, and (b) a back glass cover placed and secured to provide a back surface for the electronic device enclosure, wherein the front glass cover and the back glass cover comprise of glass substrate,
wherein the glass substrate comprises:
a glass main body having opposing major surfaces; and
a layer having a thickness provided over a majority of a first major surface, wherein at least a portion of the thickness of the layer comprises a Berkovich indenter hardness of at least 10 GPa and an x-ray amorphous structure, and
wherein the glass substrate exhibits a scratch depth reduction, when scratched using a Berkovich indenter and a load of up to about 160 mN, of at least 35%, when compared to a glass main body without the layer provided over a majority of a first major surface.

Assignees

• Corning Inc

Inventors

• Paulson Charles Andrew

Classifications

• C03C2218/156

  by magnetron sputtering · CPC title

• B32B2307/536

  Hardness · CPC title

• C03C17/225 Primary

  Nitrides · CPC title

• C03C2217/213

  SiO2 · CPC title

• Y10T428/266

  of base or substrate · CPC title