Sensor having a sensor housing

Patent metadata

Field	Value
Publication number	US-9326408-B2
Application number	US-201013512753-A
Country	US
Kind code	B2
Filing date	Oct 7, 2010
Priority date	Dec 4, 2009
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.

First claim

What is claimed is:

1. A sensor, comprising:
a sensor housing;
an electronic component; and
a sensor element, wherein the electronic component and the sensor element are electrically connected to one another in a media-tight manner via an electrically-conductive plating and first and second bonding wires, the plating including first and second bonding sites, the first bonding wire connecting the first bonding site to the sensor element, the second bonding wire connecting the second bonding site to the electronic component, wherein an adhesive which provides a seal is placed between the first and second bonding sites and between the first and second bonding wires, and wherein the adhesive is placed on the plating, and wherein a gel is applied on a media side of a base plate, the gel at least partially covering the first bonding sites and the first bonding wires.

2. The sensor as recited in claim 1 , wherein the plating is (i) implemented with molded-interconnect-device technology and (ii) embedded in a base plate of the sensor housing.

3. The sensor as recited in claim 2 , wherein the plating has at least one of a gold layer and a nickel underlayer.

4. The sensor as recited in claim 1 , wherein the plating includes a printed conductor which is one of (i) hot-stamped into a base plate of the sensor housing, (ii) sounded into the base plate of the sensor housing, or (iii) extrusion-coated by a plastic material of the base plate.

5. The sensor as recited in claim 2 , wherein the plating is embedded in the base plate between webs.

6. The sensor as recited in claim 1 , wherein the adhesive forms a media-tight connection between the plating in a base plate and a cover element of the sensor housing, the media-tight connection separating the sensor element from a further chamber in which the electronic component is accommodated.

7. The sensor as recited in claim 1 , wherein the plating is introduced into a base plate, and wherein the plating is introduced between webs formed by a material of the base plate, in such a way that in addition to the plating and the webs, free spaces are formed in the base plate, and the free spaces are at least partially filled with a material of the adhesive.

8. A sensor, comprising:
a sensor housing;
an electronic component and
a sensor element, wherein the electronic component and the sensor element are electrically connected to one another in a media-tight manner via an electrically-conductive plating and first and second bonding wires, the plating including first and second bonding sites, the first bonding wire connecting the first bonding site to the sensor element, the second bonding wire connecting the second bonding site to the electronic component, wherein an adhesive which provides a seal is placed between the first and second bonding sites and between the first and second bonding wires, and wherein the adhesive is placed on the plating, wherein the plating is (i) implemented with molded-interconnect-device technology and (ii) embedded in a base plate of the sensor housing, and wherein:
the plating is used as a printed conductor;
free spaces are formed next to the plating; and
the free spaces are filled by a filler material with the aid of the adhesive.

Assignees

• Scholzen Holger
• Gmelin Christoph
• Vollert Jens
• Ellmer Markus
• Bosch Gmbh Robert

Inventors

• Scholzen Holger
• Gmelin Christoph
• Vollert Jens
• Ellmer Markus

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title