Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
US9324778B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9324778-B2 |
| Application number | US-201213814871-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 26, 2012 |
| Priority date | Mar 29, 2011 |
| Publication date | Apr 26, 2016 |
| Grant date | Apr 26, 2016 |
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A variable inductor includes a spiral inductor, a loop conductor, and a switch for opening or short-circuiting an end of the loop conductor. The loop conductor is formed in a direction perpendicular to the spiral inductor and is used for adjusting the inductance value of the spiral inductor by opening or short-circuiting the end of the loop conductor by the switch.
Opening claim text (preview).
The invention claimed is: 1. A variable inductor comprising: a spiral inductor arranged in a plane on a semiconductor substrate; a loop conductor including an opening that is arranged in one or more layers which are lower than the plane occupied by the spiral inductor and includes a first layer conductor and a second layer conductor; a dielectric layer arranged between the loop conductor and the spiral inductor; and a switch adapted to open or close a loop of the loop conductor, the dielectric layer being arranged between the switch and the spiral inductor; wherein the first layer conductor and the second layer conductor of the loop conductor define a plane, the plane defined by the first layer conductor and the second layer conductor of the loop conductor is arranged in a direction perpendicular to and beneath the plane occupied by the spiral inductor. 2. The variable inductor according to claim 1 , wherein the spiral inductor is formed on one surface of the semiconductor substrate; and wherein the first layer conductor is formed in a layer which is lower than the spiral inductor; the second layer conductor is formed in a layer which is lower than the first layer conductor; and the variable inductor further comprises: a vertical conductor formed in a via which is formed in at least a part of the semiconductor substrate and in a direction perpendicular to the one surface of the semiconductor substrate, the vertical conductor connecting the first layer conductor to the second layer conductor. 3. The variable inductor according to claim 2 , wherein the semiconductor substrate is a silicon substrate; wherein the spiral inductor is formed from a surface conductor formed on a topmost layer of the silicon substrate; wherein the first layer conductor is an inner layer conductor positioned at a lower layer side with respect to the surface conductor through an interlayer dielectric film; wherein the second layer conductor is a backside conductor formed on a back side of the silicon substrate; and wherein the loop conductor includes: the inner layer conductor; the vertical conductor formed in a pass-through via which penetrates through the silicon substrate; and the backside conductor; and the switch adapted to open or close a loop of the loop conductor.
Inductive arrangements or effects of, or between, wiring layers · CPC title
Manufacture or treatment · CPC title
Inductors · CPC title
Electricity · mapped topic
on stacked layers · CPC title
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