Chip-on-film (COF) tape and corresponding COF bonding method

Patent metadata

Field	Value
Publication number	US-9324689-B2
Application number	US-201314235808-A
Country	US
Kind code	B2
Filing date	Nov 27, 2013
Priority date	Nov 21, 2013
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs and second COFs, the first and second COFs are arranged on the base tape in an alternating manner, and are correspondingly punched onto a moving platform by a punching mechanism, and are respectively bonded onto two side edges of a liquid crystal panel. The present invention can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.

First claim

The invention claimed is:

1. A chip-on-film (COF) bonding method, comprising steps of:
providing a COF tape comprising a base tape, a plurality of first COFs and a plurality of second COFs, wherein the first COFs and the second COFs are arranged on the base tape, and then a part of the COF tape is pulled out;
providing a punching mechanism and a moving platform, wherein the punching mechanism comprises a first punching head and a second punching head which are disposed above the COF tape, and the moving platform is disposed under the corresponding COF tape, and the first punching head punches the corresponding first COFs onto the moving platform and/or the second punching head punches the corresponding second COFs onto the moving platform;
moving the moving platform out to a position;
providing a liquid crystal panel having a first side edge and a second side edge perpendicular to each other; and
providing a first bonding head and a second bonding head, wherein the first bonding head picks up the corresponding first COFs on the moving platform to bond onto the corresponding first side edge of the liquid crystal panel, and/or the second bonding head picks up the corresponding second COFs on the moving platform to bond onto the corresponding second side edge of the liquid crystal panel.

2. The COF bonding method according to claim 1 , wherein the steps of punching and bonding are repeated, so as to accomplish bonding operations of all of the first COFs and the second COFs of the liquid crystal panel.

3. The COF bonding method according to claim 2 , wherein in a cycle section of the COF tape, the number of the first COFs and the second COFs is correspond to the number of the first COFs and the second COFs needed on a liquid crystal panel.

4. The COF bonding method according to claim 3 , wherein in the cycle section, the number of the first COFs is n+m, and the number of the second COFs is n; and wherein n of the first COFs and n of the second COFs are arranged in alternation firstly, and then m of the first COFs are arranged thereafter.

5. The COF bonding method according to claim 4 , wherein according to an arranged situation of the first COFs and the second COFs on the COF tape, the first punching head and the second punching head actuate alone or together, so as to punch the first COFs and/or the second COFs onto the moving platform.

6. The COF bonding method according to claim 5 , wherein according to a placed situation in which the first COFs and the second COFs are placed on the moving platform, the first bonding head and the second bonding head actuate alone or together, so as to bond the first COFs and/or the second COFs onto the liquid crystal panel.

7. A chip-on-film (COF) bonding method, comprising steps of:
providing a COF tape comprising a base tape, a plurality of first COFs and a plurality of second COFs, wherein the first COFs and the second COFs are arranged on the base tape, and in a cycle section of the COF tape, the number of the first COFs is n+m, and the number of the second COFs is n; and wherein n of the first COFs and n of the second COFs are arranged in alternation firstly, and then m of the first COFs are arranged thereafter; and then a part of the COF tape that n of the first COFs and n of the second COFs are arranged on is pulled out;
providing a punching mechanism and a moving platform, wherein the punching mechanism comprises a first punching head and a second punching head which are disposed above the COF tape, and the moving platform is disposed under the corresponding COF tape, and the first punching head punches the corresponding first COFs onto the moving platform and the second punching head punches the corresponding second COFs onto the moving platform;
moving the moving platform out to a position;
providing a liquid crystal panel having a first side edge and a second side edge perpendicular to each other; and
providing a first bonding head and a second bonding head, wherein the first bonding head picks up the corresponding first COFs on the moving platform to bond onto the corresponding first side edge of the liquid crystal panel, and the second bonding head picks up the corresponding second COFs on the moving platform to bond onto the corresponding second side edge of the liquid crystal panel.

8. The COF bonding method according to claim 7 , wherein the steps of claim 7 are repeated, so as to accomplish bonding operations of the part of the COF tape that n of the first COFs and n of the second COFs are arranged on.

9. The COF bonding method according to claim 8 , wherein after the steps of claim 8 , further comprising the following steps of:
pulling out the part of the COF tape that m of the first COFs are arranged on;
punching the corresponding first COFs onto the moving platform by the first punching head;
moving the moving platform out to a position; and
picking up the corresponding first COFs on the moving platform by the first bonding head to bond onto the corresponding first side edge of the liquid crystal panel.

10. The COF bonding method according to claim 9 , wherein the steps of claim 9 are repeated, so as to accomplish bonding operations of the part of the COF tape that m of the first COFs are arranged on.

Assignees

• Shenzhen China Star Optoelect

Inventors

• Qi Minghu
• Wu chun hao
• Lin Kun Hsien
• Wang Yongqiang
• Shu Zhiyou
• Yang Weibing
• Chen Zenghong
• Yang Guokun
• Li Chenyangzi
• Jiang Yunshao

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/0198

  batch processes · CPC title