Electronic substrate, semiconductor device, and electronic device
US-9251942-B2 · Feb 2, 2016 · US
US9324491B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9324491-B2 |
| Application number | US-201514863790-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 24, 2015 |
| Priority date | Dec 6, 2013 |
| Publication date | Apr 26, 2016 |
| Grant date | Apr 26, 2016 |
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An inductor device includes a layer-laminated member with laminated base-material layers and a coil with a winding axis coincident with a direction of layer lamination, a smaller-thickness portion near one end portion thereof in the direction of layer lamination, and a greater-thickness portion with more base-material layers than that in the smaller-thickness portion. The coil is located in the greater-thickness portion. The coil is connected, at its one end positioned near one end portion of the layer-laminated member, to a conductor pattern in the smaller-thickness portion. The coil is connected, at its other end positioned near the other end portion of the layer-laminated member, to a conductor pattern in a base-material layer located near the other end portion of the layer-laminated member. The conductor patterns are located at respective different positions in the direction of layer lamination.
Opening claim text (preview).
What is claimed is: 1. An inductor device comprising: a layer-laminated member including base-material layers laminated; and a coil located in the layer-laminated member with a winding axis coincident with a direction of layer lamination; wherein the layer-laminated member includes a smaller-thickness portion positioned near one end portion thereof in the direction of layer lamination, and a greater-thickness portion with a greater number of base-material layers laminated therein than that in the smaller-thickness portion; the coil is located in the greater-thickness portion; the coil is connected, at one end positioned near one end portion of the layer-laminated member, to a first terminal portion in the smaller-thickness portion; the coil is connected, at the other end positioned near the other end portion of the layer-laminated member, to a second terminal portion in a base-material layer located near the other end portion of the layer-laminated member; and the first terminal portion and the second terminal portion are located at respective different positions in the direction of layer lamination. 2. The inductor device according to claim 1 , wherein the first terminal portion and the second terminal portion are located at positions which prevent respective conductor line paths which connect both the ends of the coil to the first terminal portion and the second terminal portion from being located in the greater-thickness portion, along a direction of the winding axis of the coil, near a side of the coil. 3. The inductor device according to claim 1 , wherein the first terminal portion and the second terminal portion are located at positions which do not overlap with the coil, in a plan view of the layer-laminated member. 4. The inductor device according to claim 1 , wherein the smaller-thickness portion has flexibility; and a connector is connected to the first terminal portion in the smaller-thickness portion. 5. The inductor device according to claim 1 , wherein the layer-laminated member includes two or more smaller-thickness portions; and the smaller-thickness portions are located near both the respective end portions of the layer-laminated member in the direction of layer lamination. 6. The inductor device according to claim 1 , wherein the first terminal portion is located on an outermost layer near one end of the layer-laminated member in the direction of layer lamination; and the second terminal portion is located on an outermost layer near the other end of the layer-laminated member in the direction of layer lamination. 7. The inductor device according to claim 2 , wherein the conductor line paths are defined by via conductors. 8. The inductor device according to claim 1 , wherein the first terminal portion and the second terminal portion are located on a same main surface of the base-material layers. 9. The inductor device according to claim 1 , wherein the first terminal portion and the second terminal portion are located on opposite main surfaces of the base-material layers. 10. An electronic apparatus comprising the inductor device according to claim 1 . 11. The electronic apparatus according to claim 10 , further comprising a substrate on which the inductor device is mounted. 12. The electronic apparatus according to claim 11 , wherein the substrate includes a level difference on which the inductor device is mounted so as to straddle the level difference. 13. The electronic apparatus according to claim 11 , further comprising an interposer mounted on the substrate between the substrate and the inductor device. 14. The electronic apparatus according to claim 11 , wherein one of the first and second terminal portions is connected to the substrate via solder and the other of the first and second terminal portions is connected to the substrate via a connector. 15. The electronic apparatus according to claim 11 , wherein each of the first and second terminal portions is connected to the substrate via a connector.
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