Film-forming material for semiconductor, member-forming material for semiconductor, process member-forming material for semiconductor, underlayer film-forming material, underlayer film, and semiconductor device
US-2024352203-A1 · Oct 24, 2024 · US
US9323154B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9323154-B2 |
| Application number | US-78631907-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 11, 2007 |
| Priority date | Apr 11, 2006 |
| Publication date | Apr 26, 2016 |
| Grant date | Apr 26, 2016 |
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In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
Opening claim text (preview).
What is claimed is: 1. A method of preparing an electronic device, comprising: (a) applying a coating layer of an organic antireflective composition on a substrate, wherein the antireflective composition comprises a resin that comprises photoacid-labile groups material that produces alkaline-soluble groups upon thermal treatment or exposure to activating radiation; (b) exposing to activating radiation or thermally treating the antireflective composition coating layer to produce COOH groups; (c) crosslinking the antireflective composition coating layer with the alkaline-soluble groups; (d) applying a photoresist composition layer above the crosslinked antireflective composition coating layer; (e) exposing the applied photoresist composition coating layer to patterned activating radiation; and (f) treating the exposed photoresist layer with an aqueous alkaline developer composition to develop the patterned image in both the photoresist composition layer and the underlying antireflective composition coating layer. 2. The method of claim 1 wherein the antireflective composition coating layer is thermally treated to produce alkaline-soluble groups. 3. The method of claim 1 wherein the antireflective composition coating layer is exposed to activating radiation to produce alkaline-soluble groups. 4. The method of claim 1 wherein the alkaline-soluble groups react to form anhydride groups. 5. The method of claim 1 wherein the antireflective composition comprises a resin that comprises photoacid-labile ester groups. 6. The method of claim 1 wherein the antireflective composition comprises a resin that comprises photoacid-labile acetal groups. 7. The method of claim 1 wherein the antireflective composition comprises a resin that comprises polymerized t-butylacrylate ester or t-butylmethacrylate ester groups.
using an anti-reflective coating · CPC title
using lasers · CPC title
characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement · CPC title
having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title
Aqueous alkaline compositions · CPC title
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