Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Patent metadata

Field	Value
Publication number	US-9323147-B2
Application number	US-201414445823-A
Country	US
Kind code	B2
Filing date	Jul 29, 2014
Priority date	Dec 12, 2013
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

First claim

What is claimed is:

1. A positive photosensitive resin composition, comprising:
(A) an alkali soluble resin;
(B) a photosensitive diazoquinone compound;
(C) a phenol compound;
(D) a thermal acid generator; and
(E) a solvent, and
wherein the solvent comprises an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure,
wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 95 wt % and less than about 100 wt % based on the total amount of the solvent, and
the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 5 wt % based on the total amount of the solvent.

2. The positive photosensitive resin composition of claim 1 , wherein the solvent comprises the organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and the organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure in a ratio of about 95:5 to about 99.5:0.5.

3. The positive photosensitive resin composition of claim 1 , wherein the solvent comprises an organic solvent having a boiling point of greater than or equal to about 100° C. and less than about 160° C. and an organic solvent having a boiling point of greater than or equal to about 160° C. and less than 280° C.

4. The positive photosensitive resin composition of claim 1 , wherein the alkali soluble resin comprises a polybenzoxazole precursor, a polyimide precursor, or a combination thereof.

5. The positive photosensitive resin composition of claim 4 , wherein the polybenzoxazole precursor comprises a structural unit represented by the following Chemical Formula 1, and the polyimide precursor comprises a structural unit represented by the following Chemical Formula 2:

wherein, in the above Chemical Formulae 1 and 2,
each X 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group,
each X 2 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group,
each Y 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group, and
each Y 2 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted quadrivalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted quadrivalent to hexavalent C3 to C30 alicyclic organic group.

6. The positive photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition comprises:
about 5 to about 100 parts by weight of the photosensitive diazoquinone compound (B);
about 1 to about 30 parts by weight of the phenol compound (C);
about 1 to about 50 parts by weight of the thermal acid generator (D); and
about 100 to about 2000 parts by weight of the solvent (E),
each based on about 100 parts by weight of the alkali soluble resin (A).

7. The positive photosensitive resin composition of claim 1 , further comprising a surfactant, a leveling agent, a silane coupling agent, or a combination thereof.

8. A photosensitive resin film manufactured using the positive photosensitive resin composition of claim 1 , wherein the photosensitive resin film is manufactured by the steps of:
coating the positive photosensitive resin composition of claim 1 on a supporting substrate;
drying the coated positive photosensitive resin composition of claim 1 to form a positive photosensitive resin composition layer;
exposing the positive photosensitive resin composition layer; and
developing the positive photosensitive resin composition layer in an alkali aqueous solution to provide a photosensitive resin film.

9. A display device comprising the photosensitive resin film of claim 8 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Lee Jong-Hwa
• Kwon Ji-Yun
• Kim Sang-Soo
• Noh Kun-Bae
• Park Eun-Bi
• Baek Jae-Yeol
• Lee Bum-Jin
• Lee Sang-Haeng
• Hwang Eun-Ha

Classifications

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/0233 Primary

  characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides · CPC title

• G03F7/0226

  characterised by the non-macromolecular additives · CPC title

• G03F7/0048 Primary

  characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title

• G03F7/039

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title