Structures formed using monocrystalline silicon and/or other materials for optical and other applications

Patent metadata

Field	Value
Publication number	US-9323010-B2
Application number	US-201213454713-A
Country	US
Kind code	B2
Filing date	Apr 24, 2012
Priority date	Jan 10, 2012
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

To fabricate an interposer for interfacing waveguides (e.g. optical fiber cables) to transducers, a cavity (410) is formed in a top surface of a substrate. A first layer (520) is formed over the cavity's bottom surface, with one or more gaps in the first layer's top surface. A second layer (3410) is formed in the one or more gaps. The second layer overlaps the first layer. At least part of the first layer is removed to form channels separated from each other by portions of the second layer that are located in the one or more gaps; at least part of the first layer is removed from under the second layer. The second layer portions in the one or more gaps provide one or more spacers in the cavity; these one or more spacers at least partially cover the channels. Waveguides can be placed into the channels.

First claim

The invention claimed is:

1. A method for fabricating an interposer for interfacing a plurality of waveguides to one or more transducers, the method comprising:
forming a first cavity in a top surface of a substrate;
forming a first layer over the first cavity's bottom surface, with one or more gaps in the first layer's top surface;
forming a second layer in the one or more gaps, the second layer overlapping the first layer; and
removing at least part of the first layer to form a plurality of channels separated from each other by portions of the second layer that are located in the one or more gaps, the second layer portions in the one or more gaps providing one or more spacers in the first cavity, the one or more spacers at least partially covering the channels, wherein the plurality of channels are for supporting the waveguides for transmitting electromagnetic waves, wherein the waveguides are to be coupled to the one or more transducers;
wherein removing at least part of the first layer comprises removing at least part of the first layer from under the second layer;
wherein the method further comprises:
forming one or more conductive paths passing through the substrate outside the cavity, each conductive path passing between the top surface of the substrate and a bottom surface of the substrate;
attaching the one or more transducers above the substrate, each transducer extending over at least one said channel for being optically coupled to at least one waveguide in the channel, each transducer being electrically coupled to at least one said conductive path;
attaching a controller below the substrate, the controller being electrically coupled to each transducer by electrical circuitry comprising at least one said conductive path.

2. The method of claim 1 wherein the electromagnetic waves are in the wavelength range of 10 nm to 300 micrometers.

3. The method of claim 2 further comprising placing optical fiber cables into said channels to serve as the waveguides.

4. The method of claim 1 wherein forming the second layer comprises electroplating the second layer in the one or more gaps.

5. The method of claim 4 further comprising forming a seed layer for the electroplating of the second layer, the seed layer being formed before the first layer;
wherein forming the first layer with the one or more gaps comprises:
forming the first layer without the one or more gaps; and
removing the first layer at a location of the one or more gaps to form the one or more gaps and expose the seed layer in the one or more gaps.

6. The method of claim 1 wherein at least two adjacent first spacers meet over one of said channels.

7. The method of claim 1 wherein forming the first layer to have one or more gaps comprises:
before forming the one or more conductive paths, forming the first layer to have no gaps and to provide a planar top surface over the first cavity;
forming the one or more gaps in the first layer after forming at least parts of the one or more conductive paths.

8. A method for fabricating an interposer for interfacing a plurality of waveguides to one or more transducers, the method comprising:
forming a first cavity in a top surface of a substrate;
forming a first layer over the first cavity's bottom surface, with one or more gaps in the first layer's top surface;
forming a second layer in the one or more gaps, the second layer overlapping the first layer; and
removing at least part of the first layer to form a plurality of channels separated from each other by portions of the second layer that are located in the one or more gaps, the second layer portions in the one or more gaps providing one or more spacers in the first cavity, the one or more spacers at least partially covering the channels, wherein the plurality of channels are for supporting the waveguides for transmitting electromagnetic waves, wherein the waveguides are to be coupled to the one or more transducers;
wherein removing at least part of the first layer comprises removing at least part of the first layer from under the second layer.

9. The method of claim 8 wherein the electromagnetic waves are in the wavelength range of 10 nm to 300 micrometers.

10. The method of claim 8 further comprising placing optical fiber cables into said channels to serve as the waveguides.

11. The method of claim 8 wherein forming the second layer comprises electroplating the second layer in the one or more gaps.

12. The method of claim 11 further comprising forming a seed layer for the electroplating of the second layer, the seed layer being formed before the first layer;
wherein forming the first layer with the one or more gaps comprises:
forming the first layer without the one or more gaps; and
removing the first layer at a location of the one or more gaps to form the one or more gaps and expose the seed layer in the one or more gaps.

13. The method of claim 9 wherein at least two adjacent first spacers meet over one of said channels.

Assignees

• Kosenko Valentin
• Mcbain Edward Lee
• Uzoh Cyprian Emeka
• Monadgemi Pezhman
• Savastiouk Sergey
• Invensas Corp

Inventors

• Kosenko Valentin
• Mcbain Edward Lee
• Uzoh Cyprian Emeka
• Monadgemi Pezhman
• Savastiouk Sergey

Classifications

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• G02B6/3652

  the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers · CPC title

• G02B6/3692

  with surface micromachining involving etching, e.g. wet or dry etching steps (surface micromachining involving subtractive techniques B81C1/00055) · CPC title

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title