Imaging measurement system with a printed photodetector array

Patent metadata

Field	Value
Publication number	US-9322939-B2
Application number	US-201013390529-A
Country	US
Kind code	B2
Filing date	Aug 5, 2010
Priority date	Sep 8, 2009
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

Low cost large area photodetector arrays are provided. In a first embodiment, the photodetectors comprise an inorganic photoelectric conversion material formed in a single thick layer of material. In a second embodiment, the photodetectors comprise a lamination of several thin layers of an inorganic photoelectric conversion material, the combined thickness of which is large enough to absorb incoming x-rays with a high detector quantum efficiency. In a third embodiment, the photodetectors comprise a lamination of several layers of inorganic or organic photoelectric conversion material, wherein each layer has a composite scintillator coating.

First claim

Having thus described the preferred embodiments, the invention is now claimed to be:

1. An imaging system comprising:
a radiation source which rotates around a central z-axis of the imaging system to perform imaging scans; and
an inorganic photodetector array including several discrete inorganic photodetectors arranged on a curved support, such that each row of inorganic photodetectors is aligned along the curve of the curved support, and each column of inorganic photodetectors is aligned in parallel to the central z-axis of the imaging system, wherein conductor paths are disposed along a distal surface of the curved support which is substantially opposite a surface of the support on which the inorganic photodetectors are disposed, and further comprising holes in the support filled with a conductor material different than the conductor path to electrically connect the conductor paths to the inorganic photodetectors, wherein the conductor paths associated with a column of inorganic photodetectors are located along the distal surface of the support opposite the column of inorganic photodetectors to a side of the inorganic photodetector array.

2. The imaging system of claim 1 , wherein the inorganic photodetectors comprise at least one of CIGS, AuInGaSe 2 , and AuInThSe 2 .

3. The imaging system of claim 1 , wherein the curved support comprises a bendable sheet.

4. The imaging system of claim 3 , wherein the bendable sheet comprises a PET sheet, a polyimide sheet, a PEET sheet, or a nylon sheet.

5. The imaging system of claim 1 , wherein each row of inorganic photodetectors corresponds to a single imaging slice during imaging scans performed by the imaging system.

6. The imaging system of claim 1 , further comprising one or more scintillators disposed between the radiation source and the inorganic photodetectors.

7. The imaging system of claim 6 , wherein the scintillators are formed from a composite scintillator material.

8. The imaging system of claim 1 , wherein the inorganic photodetectors are disposed on the curved support by a printing process.

9. The imaging system of claim 1 , the inorganic photodetectors operatively connectable via said conductor paths to one or more active electronic components disposed on the curved support.

10. The imaging system of claim 9 , wherein the curved support is comprised of more than one layer including a top layer and one or more under-layers, the inorganic photodetectors are disposed on the top layer, and each under-layer comprises a top surface which is proximate to the top layer and on which is disposed at least one of the conductor paths.

11. The imaging system of claim 1 , wherein the curved support extends around a complete circumference of the central z-axis of the imaging system.

12. The imaging system of claim 1 , wherein the inorganic photodetector array comprises two layers of inorganic photodetectors, a first layer associated with one or more high energy inorganic photoelectric materials, and a second layer associated with one or more low energy inorganic photoelectric materials.

13. The imaging system of claim 1 , wherein the inorganic photodetector array comprises at least two sectorial-shaped elements in a stacked relationship with each other, with several discrete inorganic photodetectors arranged on the sectorial-shaped elements.

14. The imaging system of claim 1 , wherein the inorganic photodetector array comprises a bendable inorganic photodetector array, the array comprising a bendable support, one or more active electronic components disposed on the support, and conductor paths operatively connecting each of the inorganic photodetectors to at least one of the active electronic components.

15. The imaging system of claim 14 , wherein the inorganic photodetectors are arranged in rows and columns on the bendable support, each row of inorganic photodetectors corresponds to a single imaging slice during imaging scans performed by an imaging system, and the columns are aligned in parallel to a central z-axis of the imaging system.

16. The imaging system of claim 14 , wherein the inorganic photodetectors comprise at least one of CIGS, AuInGaSe 2 , and AuInThSe 2 .

17. The imaging system of claim 14 , wherein the bendable support comprises a PET sheet, a polyimide sheet, a PEET sheet, or a nylon sheet.

18. The imaging system of claim 14 , further comprising composite scintillators disposed on top of the inorganic photodetectors.

19. The imaging system of claim 14 , wherein the assembly is mounted on a cradle within an imaging system to form an imaging data measurement system.

20. The imaging system of claim 14 , wherein the inorganic photodetectors are disposed on the support by a printing process.

21. The imaging system of claim 14 , wherein the conductor paths are disposed on a common surface of the bendable support with the inorganic photodetectors.

22. The imaging system of claim 14 , wherein the conductor paths are disposed on a distal surface of the support substantially opposite a surface on which the inorganic photodetectors are disposed, and the support comprises holes filled with a conductor material to electrically connect the conductor paths to the inorganic photodetectors.

23. The imaging system of claim 22 , wherein the support is comprised of more than one layer including a top layer and one or more under-layers, the inorganic photodetectors are disposed on the top layer, and each under-layer comprises a top surface which is proximate to the top layer and on which is disposed at least one of the conductor paths.

24. The imaging system of claim 14 , wherein the bendable support has a length which is approximately equal to an entire circumference surrounding a central z-axis of the imaging system, for use in a fourth generation imaging system.

25. The imaging system of claim 14 , wherein the inorganic photodetector array comprises two layers of inorganic photodetectors, a first layer associated with one or more high energy inorganic photoelectric materials, and a second layer associated with one or more low energy inorganic photoelectric materials.

26. The imaging system of claim 14 , further comprising one or more fiducial apertures disposed in the bendable support.

27. The imaging system of claim 1 , wherein a plurality of the conductor paths on the distal surface route opposite an area of one inorganic photodetector.

28. The imaging system of claim 27 , wherein at least seven conductor paths on the distal surface route opposite the area of one inorganic photodetector.

29. The imaging system of claim 1 , further comprising a common ground connected to a plurality of inorganic photodetectors.

30. The imaging system of claim 29 , wherein the common ground comprises a conductive layer disposed above the photodetectors.

31. The imaging system of claim 1 , wherein a conductor forms a base of each hole.

32. The imaging system of claim 1 , wherein the conductor material comprises a conductive adhesive.

33. A method of making an inorganic photodetector array for use in an imaging system, the method comprising:
disposing several discrete inorganic photodetectors on a front surface of a curved support;
placing one or more active electronic components on the distal surface of the support;
forming conductor paths

Assignees

• Levene Simha
• Altman Ami
• Wainer Naor
• Ronda Cornelis Reinder
• Haskal Eliav Itshak
• De Leeuw Dagobert Michel
• Koninkl Philips Nv

Inventors

• Levene Simha
• Altman Ami
• Wainer Naor
• Ronda Cornelis Reinder
• Haskal Eliav Itshak
• De Leeuw Dagobert Michel

Classifications

• G01T1/2985 Primary

  In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); (using external radiation sources A61B6/02) · CPC title

• G01T1/242

  Stacked detectors, e.g. for depth information (constructional or manufacturing details H10W90/00) · CPC title

• G01T1/2018

  Scintillation-photodiode combinations · CPC title

• G01T1/249

  specially adapted for use in SPECT or PET (SPECT imaging G01T1/1642; PET imaging G01T1/2985; detecting prohibited goods, e.g. weapons, explosives, hazardous substances, contraband or smuggled objects G01V5/20) · CPC title

• G01T1/20189

  Damping or insulation against damage, e.g. caused by heat or pressure · CPC title