Heat radiation device and illuminating device having said heat radiation device

Patent metadata

Field	Value
Publication number	US-9322540-B2
Application number	US-201214365107-A
Country	US
Kind code	B2
Filing date	Nov 20, 2012
Priority date	Dec 14, 2011
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

Various embodiments relate to a heat radiation device for a heat source. The heat radiation device includes a body and a coating layer, wherein the body has a first section and at least one second section projecting from the first section, the first section has a mounting surface for mounting and thermally contacting with the heat source and the coating layer is applied on the surface other than the mounting surface of the first section and a surface of the at least one second section, wherein the coating layer has higher thermal dissipation performance than the body. In addition, various embodiments further relate to an illuminating device having the above type of heat radiation device.

First claim

The invention claimed is:

1. A heat radiation device for a heat source, comprising a body and a coating layer, wherein the body has a first section and at least one second section projecting from the first section, the first section has a mounting surface for mounting and thermally contacting with the heat source and the coating layer is applied on a surface other than the mounting surface of the first section and a surface of the at least one second section, wherein the coating layer has higher thermal dissipation performance than the body, wherein at least one thermal via is opened in the first section and the at least one second section.

2. The heat radiation device according to claim 1 , wherein the coating layer is made of coating having a thermal conductivity greater than 5 W/m/K.

3. The heat radiation device according to claim 2 , wherein the coating is mixed with one component selected from a group consisting of nickel, silver, graphite, nano-carbon, TiO 2 , Al 2 O 3 , boron nitride, and spinel.

4. The heat radiation device according to claim 2 , wherein the coating layer has a thickness of 200 to 500 micron.

5. The heat radiation device according to claim 1 , wherein the body is made of low thermally conductive plastic with a thermal conductivity lower than 1 W/m/K.

6. The heat radiation device according to claim 5 , wherein the first section and the second section are moulded in one piece by injection moulding.

7. The heat radiation device according to claim 6 , wherein the low thermally conductive plastic is a polybutylene terephthalate, poly oxymethylene, polyamide, or acrylonitrile butadiene styrene material.

8. The heat radiation device according to claim 1 , wherein the at least one second section is at least one fin projecting from the first section.

9. The heat radiation device according to claim 1 , wherein the thermal vias in the first section extend traverse to extension direction of the first section and the thermal vias in the second section extend traverse to the extension direction of the second section.

10. The heat radiation device according to claim 9 , wherein the thermal via is filled by the same material as that of the coating layer.

11. An illuminating device, having a heat radiation device for a heat source, the heat radiation device comprising a body and a coating layer, wherein the body has a first section and at least one second section projecting from the first section, the first section has a mounting surface for mounting and thermally contacting with the heat source and the coating layer is applied on a surface other than the mounting surface of the first section and a surface of the at least one second section, wherein the coating layer has higher thermal dissipation performance than the body, wherein at least one thermal via is opened in the first section and the at least one second section.

12. The illuminating device according to claim 11 , wherein the heat source comprises a circuit board and an LED chip provided on the circuit board.

13. The illuminating device according to claim 12 , wherein the circuit board is configured as a non-electrically isolated metal core printed circuit board, or an electrically isolated ceramic printed circuit board.

14. The illuminating device according to claim 11 , wherein a circuit board and the body are moulded together.

15. The illuminating device according to claim 11 , wherein a circuit board is attached to the mounting surface of the first section of the body with a thermal interface material.

Assignees

• Osram Gmbh

Inventors

• Cheng Yingjun

Classifications

• F21V29/777

  the planes containing the fins or blades having directions perpendicular to the light emitting axis · CPC title

• F28F21/089

  Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence) · CPC title

• F21V19/005

  by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound · CPC title

• F28F13/18

  by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing · CPC title

• F28F21/067

  Details · CPC title