Methods for manufacturing floor panels

US9322184B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9322184-B2
Application numberUS-201314015307-A
CountryUS
Kind codeB2
Filing dateAug 30, 2013
Priority dateMay 10, 2010
Publication dateApr 26, 2016
Grant dateApr 26, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a floor panel that includes a synthetic material board and a top layer located on top of the synthetic material board, the top layer including a printed motif and a translucent or transparent wear layer, the method comprising: manufacturing the synthetic material board with an average density of more than 300 kilograms per cubic meter; wherein the synthetic material board includes filler materials selected from the group consisting of chalk, wood fiber, and sand; and wherein at least one separate layer is embedded in the synthetic material board, the separate layer being one of a glass fiber cloth and a glass fiber fabric; providing the top layer, including the printed motif, on the synthetic material board; and mechanically embossing the top layer; wherein manufacturing the synthetic material board and providing the top layer are performed continuously on the same production line. 2. The method of claim 1 , wherein manufacturing the synthetic material board comprises extruding the synthetic material board. 3. The method of claim 1 , wherein providing the top layer comprises placing extruded polyvinyl chloride via heated rollers as a layer-shaped covering on a carrier material. 4. The method of claim 3 , wherein the carrier material comprises glass fiber. 5. The method of claim 3 , wherein the carrier material comprises the synthetic material board. 6. The method of claim 3 , wherein the polyvinyl chloride comprises plasticizers. 7. The method of claim 1 , wherein providing the top layer comprises adhering one or more vinyl containing synthetic material films to the synthetic material board. 8. The method of claim 1 , wherein a board is formed comprising the synthetic material board and the top layer; and wherein the method further comprises dividing the board into a plurality of floor panels. 9. The method of claim 1 , wherein the floor panel is rigid and cannot be wound up. 10. The method of claim 1 , further comprising providing mechanical coupling means to the floor panel, the mechanical coupling means allowing the floor panel to be coupled at edges to one or more similar panels.

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What does patent US9322184B2 cover?
In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermop…
Who is the assignee on this patent?
Meersseman Laurent, Segaert Martin, Thiers Bernard, and 3 more
What technology area does this patent fall under?
Primary CPC classification E04F15/02038. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).