Thermoplastic resin composite containing hollow glass microsheres

US9321906B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9321906-B2
Application numberUS-201214115046-A
CountryUS
Kind codeB2
Filing dateMay 1, 2012
Priority dateMay 2, 2011
Publication dateApr 26, 2016
Grant dateApr 26, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermoplastic resin composite with improved specific flexural strength, and a molded body containing the thermoplastic resin composite. A thermoplastic resin composite containing a resin component which is a polyamide resin or polypropylene resin, and hollow glass microspheres, wherein the hollow glass microspheres are surface treated with from 0.5 to 3 mass % of a silane coupling agent and from 1 to 5 mass % of a synthetic resin emulsion, based on 100 mass % of hollow glass microspheres.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermoplastic resin composite comprising a host resin selected from a polyamide resin and a polypropylene resin, and further comprising hollow glass microspheres, wherein the hollow glass microspheres are surface treated with from 0.5 to 3 mass % of a silane coupling agent and from 1 to 5 mass % of a synthetic resin emulsion, based on 100 mass % of the hollow glass microspheres, wherein the synthetic resin emulsion is selected from the group consisting of a polyamide emulsion and a maleic acid modified polypropylene emulsion. 2. The thermoplastic resin composite according to claim 1 , wherein the silane coupling agent is an amino silane coupling agent. 3. A molded body containing a thermoplastic resin composite according to claim 1 .

Assignees

Inventors

Classifications

  • C08K9/06Primary

    with silicon-containing compounds · CPC title

  • Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

  • with silicon-containing compounds · CPC title

  • Treatment with macromolecular organic compounds {(C09C3/006 takes precedence)} · CPC title

  • containing nitrogen · CPC title

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Frequently asked questions

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What does patent US9321906B2 cover?
A thermoplastic resin composite with improved specific flexural strength, and a molded body containing the thermoplastic resin composite. A thermoplastic resin composite containing a resin component which is a polyamide resin or polypropylene resin, and hollow glass microspheres, wherein the hollow glass microspheres are surface treated with from 0.5 to 3 mass % of a silane coupling agent and f…
Who is the assignee on this patent?
Takeishi Towako, Yamabe Takujiro, Takakuwa Kyoko, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08K9/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).