Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes

US9321880B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9321880-B2
Application numberUS-201314422047-A
CountryUS
Kind codeB2
Filing dateNov 11, 2013
Priority dateNov 13, 2012
Publication dateApr 26, 2016
Grant dateApr 26, 2016

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Abstract

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A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes an hardener mixture containing mainly polyethylene tetraamines. The system include triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.

First claim

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The invention claimed is: 1. A curable epoxy resin system, comprising 1) an epoxy resin component containing one or more epoxy resins, wherein at least 80% by weight of the epoxy resins is one or more polyglycidyl ethers of a polyphenol that has an epoxy equivalent weight of up to about 250; 2) an amine hardener, wherein the amine hardener is a polyethylene tetraamine mixture containing at least 95% by weight polyethylene tetraamines, the mixture containing at least 40% by weight linear triethylene tetraamine, wherein at least 0.8 epoxy equivalents are provided to the reaction mixture by the epoxy resin component per amine hydrogen equivalent provided by the amine hardener; and 3) 0.01 to 0.5 moles of triethylene diamine per mole of primary and/or secondary amine compounds in the amine hardener, the triethylene diamine being present in the epoxy resin component, the amine hardener, or both. 2. The curable epoxy resin system of claim 1 , which contains 0.05 to 0.175 moles of triethylene diamine per mole of primary and/or secondary amine compounds in the amine hardener. 3. The curable epoxy resin system of claim 1 , which further comprises 0.1 to 10 parts by weight, per part by weight triethylene diamine, of a hydroxyl compound selected from the group consisting of water and compounds having at least one hydroxyl group and an equivalent weight per hydroxyl group of up to 75. 4. The curable epoxy resin system of claim 3 , wherein the hydroxyl compound is one or more of water, an alkanol, an alkylene glycol, a glycol monoether, a glycol monoester, trimethylolpropane, glycerin, an oligomer of glycerin, trimethylolethane, pentaerythritol, erythritol, sorbitol, sucrose or a mono-, di- or trialkanolamine. 5. A process for forming a fiber-reinforced epoxy composite having a cured epoxy resin phase having reinforcing fibers dispersed therein, comprising; a) mixing an epoxy resin component with an amine hardener by impingement mixing and transferring the resulting reactive mixture into a mold that contains reinforcing fibers, and b) curing the reactive mixture in the mold at an elevated temperature to form a fiber-reinforced composite in which the reinforcing fibers are embedded in a polymeric matrix formed by curing the reactive mixture, and c) demolding the fiber-reinforced composite, wherein; 1) the epoxy resin component contains one or more epoxy resins, wherein at least 80% by weight of the epoxy resin is one or more polyglycidyl ethers of a polyphenol that has an epoxy equivalent weight of up to about 250; 2) the amine hardener is a polyethylene tetraamine mixture containing at least 95% by weight polyethylene tetraamines, the mixture containing at least 40% by weight linear triethylene tetraamine, 3) in step a) the epoxy resin component and the amine hardener are mixed in proportions which, prior to reaction, provide 0.8 to 1.25 epoxy equivalents per amine hydrogen equivalent of primary and/or secondary amine compounds; and 4) 0.01 to 0.5 moles of triethylene diamine are provided in the reactive mixture per mole of primary and/or secondary amine compounds provided in the amine hardener. 6. The process of claim 5 , wherein 0.05 to 0.175 moles of triethylene diamine are provided to the reactive mixture per mole of primary and/or secondary amine compounds in the amine hardener. 7. The process of claim 5 , wherein 0.1 to 10 parts by weight, per part by weight triethylene diamine, of a hydroxyl compound selected from the group consisting of water and compounds having at least one hydroxyl group and an equivalent weight per hydroxyl group of up to 75, are provided to the reactive mixture. 8. The process of claim 7 , wherein the hydroxyl compound is one or more of water, an alkanol, an alkylene glycol, a glycol monoether, a glycol monoester, trimethylolpropane, trimethylolethane, pentaerythritol, erythritol, sorbitol, sucrose or a mono-, di- or trialkanolamine. 9. The process of claim 5 , wherein the reactive mixture system exhibits a gel time of at least 60 seconds and a time to vitrification of no greater than 350 seconds on a preheated rheomoeter at at least one cure temperature 100 and 120° C. 10. The process of claim 5 , wherein the reactive mixture exhibits a gel time of at least 10 seconds and a time to vitrification of no greater than 120 seconds on a preheated rheomoeter at at least one cure temperature 100 and 120° C. 11. The process of claim 5 , wherein the elevated temperature is from 80 to 140° C. 12. The process of claim 5 , wherein the demold time is 120 seconds or less. 13. The process of claim 5 , wherein the cured epoxy resin phase has a glass transition temperature of at least 110° C. at the time of demold. 14. The process of claim 5 , which is a resin transfer molding process, a wet compression molding process or a gap injection molding process. 15. The process of claim 5 , wherein the epoxy resin component and the amine hardener are mixed in proportions which, prior to reaction, provide 0.8 to 1.25 epoxy equivalents per equivalent of amine hydrogens. 16. The process of claim 5 , wherein the polyethylene tetramine mixture contains no more than 0.3% by weight aminoethylethanolamine. 17. The process of claim 5 , wherein the reactive mixture contains an internal mold release agent. 18. A cured fiber-reinforced composite made by the process of claim 5 .

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What does patent US9321880B2 cover?
A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes an hardener mixture containing mainly polyethylene tetraamines. The system include triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics th…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08G59/502. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).