Forming magnetic microelectromechanical inductive components

Patent metadata

Field	Value
Publication number	US-9321634-B2
Application number	US-201514608841-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Mar 12, 2013
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.

First claim

What is claimed is:

1. A method of manufacturing a micro-electromechanical device, comprising:
forming a sacrificial layer on a wafer;
forming a metal layer of the micro-electromechanical device on the sacrificial layer;
electrolessly depositing a soft magnetic material on the metal layer to coat a top surface and side surfaces of the metal layer; and
removing the sacrificial layer after electrolessly depositing the soft magnetic material to produce a suspended metal beam coupled to at least one support structure of the wafer, wherein removing the sacrificial layer reveals a bottom surface of the metal layer.

2. The method of claim 1 further comprising forming an active metal surface on the metal layer and electrolessly depositing the soft magnetic material on the active metal surface.

3. The method of claim 2 , wherein the forming the active metal surface further comprises forming a layer of palladium on a surface of the metal layer.

4. The method of claim 1 , wherein the soft magnetic material is one of: a high-resistivity material, a cobalt-based alloy, and cobalt-tungsten-phosphorus-based alloy.

5. A method of manufacture an inductive component of a micro-electromechanical device, comprising:
forming a wafer substrate having a support structure;
forming a sacrificial layer on the wafer substrate;
forming a metal layer coupled to the support structure on the sacrificial layer; and
electrolessly depositing a soft magnetic material on a top surface and side surfaces of the metal layer; and
removing the sacrificial layer after electrolessly depositing the soft magnetic material to manufacture the inductive component having a bottom surface that reveals the metal layer.

6. The method of claim 5 further comprising forming an active metal surface on the metal layer and electrolessly depositing the soft magnetic material on the active metal surface.

7. The method of claim 6 , wherein the forming the active metal surface further comprises forming a layer of palladium on a surface of the metal layer.

8. The method of claim 5 , further comprising forming a first part of the metal layer coupled to the support structure and second part of the metal layer on a sacrificial layer; and removing the sacrificial layer to form a supported metal beam from the metal layer.

9. The method of claim 5 further comprising forming the metal beam to be supported over an electrically conductive element in the wafer.

10. A method of manufacturing a micro-electromechanical member, comprising:
forming a sacrificial layer on a silicon substrate;
forming a metal layer on a top surface of the sacrificial layer;
electrolessly depositing a soft magnetic material on the metal layer to coat a top surface and side surfaces of the metal layer; and
removing the sacrificial layer after electrolessly depositing the soft magnetic material to produce a metal beam separated from the silicon substrate by a space, wherein removing the sacrifiacial layer reveals a bottom surface of the metal layer.

11. The method of claim 10 further comprising forming an active metal surface on the metal layer and electrolessly depositing the soft magnetic material on the active metal surface.

12. The method of claim 10 , wherein the soft magnetic material is one of: a high-resistivity material, a cobalt-based alloy, and cobalt-tungsten-phosphorus.

Assignees

• IBM

Inventors

• Gallagher William J
• O'Sullivan Eugene J
• Wang Naigang

Classifications

• H10D1/20

  Inductors · CPC title

• B81C1/00373 Primary

  Selective deposition, e.g. printing or microcontact printing · CPC title

• H01L43/12

  Electricity · mapped topic

• B81B2201/038

  Microengines and actuators not provided for in B81B2201/031 - B81B2201/037 · CPC title

• H01L43/14

  Electricity · mapped topic