Reduced wire profile stent

US9320623B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9320623-B2
Application numberUS-201213644255-A
CountryUS
Kind codeB2
Filing dateOct 3, 2012
Priority dateOct 4, 2011
Publication dateApr 26, 2016
Grant dateApr 26, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.

First claim

Opening claim text (preview).

What is claimed is: 1. A stent comprising: a wire braided into a tubular body comprising a proximal tube portion, a distal tube portion, a central tube portion disposed between the proximal tube portion and the distal tube portion, and a lumen extending between the proximal tube portion and the distal tube portion; both the proximal tube portion and the distal tube portion each comprises a flange, each flange having an inner flange end, a central flange portion, and an outer flange end terminating in crowns, each flange having a diameter that is greater than the central tube portion; the inner flange ends and the central tube portion each having an initial wire profile; each central flange portion comprising a wire second portion, each wire second portion having a wire profile smaller than the initial wire profile; and the crowns on each flange comprising a wire first portion, each wire first portion having a wire profile smaller than the initial wire profile and smaller than the wire profiles of the wire second portions; wherein the wire profile of each wire first portion is smaller than the initial wire profile by a first electropolished reduction amount; the wire profile of each wire second portion is smaller than the initial wire profile by a second electropolished reduction amount; each wire first portion and each wire second portion has an electropolished surface; and the initial wire profile is maintained constant from the central tube portion to the inner flange end; and wherein a radial force exerted from the stent is tailored to the surrounding tissue, with the radial force at each wire first portion being less than the radial force at each wire second portion. 2. The stent of claim 1 , wherein each wire first portion has a wire profile about 10% to about 75% smaller than the initial wire profile. 3. The stent of claim 1 , wherein each wire first portion has a wire profile about 50% smaller than the initial wire profile. 4. The stent of claim 1 , wherein the wire braided into the tubular body has a circular cross-sectional profile. 5. A stent comprising: a wire braided into a tubular body comprising a proximal tube portion, a distal tube portion, a central tube portion disposed between the proximal tube portion and the distal tube portion, and a lumen extending between the proximal tube portion and the distal tube portion; both the proximal tube portion and the distal tube portion each comprises a flange, each flange having an inner flange end, a central flange portion, and an outer flange end terminating in crowns, each flange having a diameter that is greater than the central tube portion; the central tube portion and the central flange portions each having an initial wire profile; the crowns on each flange comprising a wire first portion, each wire first portion having a wire profile smaller than the initial wire profile; and each portion of the tubular body transitioning from the central tube portion to each inner flange end comprising a wire second portion, each wire second portion having a wire profile smaller than the initial wire profile; wherein the wire profile of each wire first portion is smaller than the initial wire profile by a first electropolished reduction amount; the wire profile of each wire second portion is smaller than the initial wire profile by a second electropolished reduction amount; each wire first portion and each wire second portion has an electropolished surface; and the initial wire profile is maintained constant in the central tube portion and each central flange portion; and wherein a radial force exerted from the stent is tailored to the surrounding tissue. 6. The stent of claim 5 wherein the wire braided into the tubular body has a circular cross-sectional profile. 7. The stent of claim 1 , wherein the wire braided into the tubular body is a single wire. 8. The stent of claim 1 , wherein the wire braided into the tubular body is braided in a helical pattern. 9. The stent of claim 5 , wherein each wire first portion has a wire profile about 50% smaller than the initial wire profile. 10. The stent of claim 5 , wherein the wire braided into the tubular body is a single wire. 11. The stent of claim 5 , wherein the wire braided into the tubular body is braided in a helical pattern.

Assignees

Inventors

Classifications

  • Polishing · CPC title

  • A61F2/90Primary

    characterised by a net-like or mesh-like structure · CPC title

  • with sharp anchoring protrusions, e.g. barbs, pins, spikes · CPC title

  • differing in diameter · CPC title

  • Fixation appliances for connecting prostheses to the body · CPC title

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Frequently asked questions

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What does patent US9320623B2 cover?
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Who is the assignee on this patent?
Cook Medical Technologies Llc
What technology area does this patent fall under?
Primary CPC classification A61F2/90. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).