System and method for dissipating thermal energy away from electronic components in a rotatable shaft

US9320181B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9320181-B1
Application numberUS-201414541203-A
CountryUS
Kind codeB1
Filing dateNov 14, 2014
Priority dateNov 14, 2014
Publication dateApr 19, 2016
Grant dateApr 19, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for dissipating thermal energy from electronic components disposed within a rotatable shaft includes an annular carrier shaft having one end formed to couple to an end of a rotor shaft. The system also includes a transmitter assembly. The transmitter includes an outer casing, a daughter board and a circuit board electronically coupled to the daughter board within an inner pocket of the transmitter housing. The circuit board comprises a strip of thermally conductive material. The transmitter assembly further includes a lid that at least partially seals the inner pocket. A contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board and at least a portion of a top surface of the lid is thermally coupled to an inner surface of the carrier shaft during rotation thereof. A method for dissipating thermal energy away from the circuit board is also provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for dissipating thermal energy away from electronic components disposed within a rotatable shaft, comprising: an annular carrier shaft having an inner surface radially spaced from an outer surface and one end formed to couple to an end of a rotor shaft; and a transmitter assembly radially supported within the carrier shaft, the transmitter assembly comprising: a transmitter housing defining an inner pocket therein; a daughter board that extends laterally and longitudinally across a bottom portion of the transmitter housing; a circuit board electronically coupled to the daughter board, the circuit board extending substantially perpendicular to the daughter board within the inner pocket, wherein the circuit board comprises a strip of thermally conductive material disposed along a top portion of the circuit board; and a lid connected to a top portion of the transmitter housing at least partially sealing the inner pocket, wherein a contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board, wherein at least a portion of a top surface of the lid is in thermal communication with the inner surface of the carrier shaft during rotation thereof. 2. The system as in claim 1 , further comprising a thermally conductive shim disposed between the top portion of the circuit board and the contact surface of the lid, wherein the shim defines a thermal conduction path between the strip of thermally conductive material and the contact surface of the lid. 3. The system as in claim 1 , further comprising a contact member coupled to the top portion of the circuit board, wherein the contact member defines a thermal conduction path between the strip of thermally conductive material and the contact surface of the lid. 4. The system as in claim 1 , wherein the top surface of the lid is arcuate. 5. The system as in claim 1 , wherein the top surface of the lid and the inner surface of the carrier shaft have substantially the same profile. 6. The system as in claim 1 , wherein the circuit board comprises a plurality of electronic components connected to the circuit board proximate to the top portion and thermally coupled to the strip of thermally conductive material. 7. The system as in claim 1 , further comprising a partitioning plate, wherein the top portion of the circuit board extends at least partially therethrough. 8. The system as in claim 1 , wherein the transmitter housing includes a vertically oriented slot disposed within the inner pocket. 9. The system as in claim 8 , wherein the circuit board is seated within the vertically oriented slot. 10. A turbomachine, comprising: an annular rotor shaft; a plurality of sensor wire bundles extending outwardly from an inner passage of the rotor shaft; an annular carrier shaft formed to couple at a first end to an end portion of the rotor shaft, the carrier shaft having a second end axially spaced from the first end and an inner surface radially spaced from an outer surface; a plurality of transmitter assemblies annularly arranged and circumferentially spaced within the carrier shaft, each transmitter assembly comprising: a transmitter housing defining an inner pocket therein; a daughter board that extends laterally and longitudinally across a bottom portion of the transmitter housing, wherein the daughter board is electronically coupled at one end to one wire bundle of the plurality of wire bundles; a circuit board electronically coupled to the daughter board, the circuit board extending substantially perpendicular to the daughter board within the inner pocket, wherein the circuit board comprises a strip of thermally conductive material disposed along a top portion of the circuit board; and a lid connected to a top portion of the transmitter housing at least partially sealing the inner pocket, wherein a contact surface of the lid is in thermal communication with the strip of thermally conductive material of the circuit board, wherein at least a portion of a top surface of the lid is in thermal communication with the inner surface of the carrier shaft during rotation thereof. 11. The turbomachine as in claim 10 , further comprising a thermally conductive shim disposed between the top portion of the circuit board and the contact surface of the lid, wherein the shim defines a thermal conduction path between the strip of thermally conductive material and the contact surface. 12. The turbomachine as in claim 10 , further comprising a contact member coupled to the top portion of the circuit board, wherein the contact member defines a thermal conduction path between the strip of thermally conductive material and the contact surface of the lid. 13. The turbomachine as in claim 10 , wherein the top surface of the lid and the inner surface of the carrier shaft have substantially the same profile. 14. The turbomachine as in claim 10 , wherein the circuit board comprises a plurality of integrated circuit components connected to the circuit board proximate to the top portion and thermally coupled to the strip of thermally conductive material. 15. The turbomachine as in claim 10 , further comprising a partitioning plate, wherein the top portion of the circuit board extends at least partially therethrough. 16. The turbomachine as in claim 10 , wherein the transmitter housing includes a vertically oriented slot disposed within the inner pocket. 17. The turbomachine as in claim 16 , wherein the circuit board is seated within the vertically oriented slot. 18. A method for dissipating thermal energy from electronic components disposed within a rotatable shaft, comprising: thermally coupling an outer surface of a lid of a transmitter assembly against an inner surface of an annular carrier shaft via centrifugal forces by rotating the carrier shaft, wherein the lid is connected to a top portion of a transmitter housing of the transmitter assembly and at least partially seals an inner pocket formed within the transmitter housing; passing a current through at least one electrical component disposed on a circuit board mounted within the inner pocket, wherein the component generates thermal energy as the current flows therethrough, and wherein the circuit board comprises a strip of thermally conductive material disposed along a top portion of the circuit board and that is thermally coupled to the electronic component; conductively transferring at least a portion of the thermal energy generated by the electronic component from the circuit board to the lid via a contact surface of the lid; and conductively transferring the thermal energy from the lid to the carrier shaft. 19. The method as in claim 18 , wherein at least a portion of the thermal energy is conductively transferred from the circuit board to the contact surface of the lid via at least one of a contact member that is thermally coupled to the strip of the thermally conductive material and a thermally conductive shim that is disposed between the top portion of the circuit board and the contact surface of the lid. 20. The method as in claim 18 , further comprising directing a coolant across an outer surface of the carrier shaft.

Assignees

Inventors

Classifications

  • H05K7/209Primary

    Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

  • specially adapted for power drive units or power converters · CPC title

  • Heat sinks · CPC title

  • Heat bridges · CPC title

  • for measuring, monitoring, testing, protecting or switching (rectifiers H02K11/04; power electronics H02K11/33) · CPC title

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What does patent US9320181B1 cover?
A system for dissipating thermal energy from electronic components disposed within a rotatable shaft includes an annular carrier shaft having one end formed to couple to an end of a rotor shaft. The system also includes a transmitter assembly. The transmitter includes an outer casing, a daughter board and a circuit board electronically coupled to the daughter board within an inner pocket of the…
Who is the assignee on this patent?
Gen Electric
What technology area does this patent fall under?
Primary CPC classification H05K7/209. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).