Semiconductor device having a bulge portion and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9320173-B2
Application number	US-201314374363-A
Country	US
Kind code	B2
Filing date	Feb 18, 2013
Priority date	Feb 24, 2012
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins;
an insulation layer formed on the second major plane of the base plate;
a circuit pattern fixed to the insulation layer;
a semiconductor element connected to the circuit pattern; and
a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element, wherein
the bulge portion formed on the first major plane continuously encircles the plurality of fins,
the base plate has a widthwise margin on an outer peripheral edge of the first major plane of the base plate,
the bulge portion is formed on the widthwise margin and divides the widthwise margin into an outer widthwise margin arranged outside of the bulge portion and an inner widthwise margin arranged inside of the bulge portion, and
the sealing resin covers an outer peripheral side face of the bulge portion and the outer widthwise margin.

2. The semiconductor device of claim 1 , wherein the plurality of fins are arranged in a certain direction.

3. The semiconductor device of claim 2 , wherein each of the plurality of fins has a slit formed therein to penetrate in the thickness direction of the fins.

4. The semiconductor device of claim 3 , wherein the respective slits formed in the plurality of fins are arranged in a line.

5. The semiconductor device of claim 1 , wherein the insulation layer contains inorganic powder.

6. The semiconductor device of claim 1 , wherein a metal plate is fitted into the base plate.

7. The semiconductor device of claim 1 , wherein at least part of the semiconductor elements is constituted with a wide bandgap semiconductor.

8. The semiconductor device of claim 7 , wherein the wide bandgap semiconductor is a semiconductor formed of any of silicon carbide, a gallium-nitride-based material, and diamond.

9. A method of manufacturing a semiconductor device, the method comprising:
forming integrally a base plate having a plurality of fins held upright on the base plate and a bulge portion formed on the base plate to encircle continuously the plurality of fins and to have a widthwise margin on an outer peripheral edge of the base plate, the bulge portion being formed on the widthwise margin and dividing the widthwise margin into an outer widthwise margin arranged outside of the bulge portion and an inner widthwise margin arranged inside of the bulge portion;
fixing a semiconductor element to the base plate;
placing the base plate into a molding die provided with a placing stage at a position higher than the bottom of the molding die so that the bulge portion is brought into contact with the placing stage with the plurality of fins down;
injecting a molding resin into the molding die in which the base plate is placed to cover an outer peripheral side face of the bulge portion and the outer widthwise margin; and
curing the injected molding resin by heating.

10. The semiconductor device of claim 1 , wherein the bulge portion has a narrower width at a position closer to its top.

11. The semiconductor device of claim 1 , wherein the widthwise margin has a constant width from the outer peripheral edge of the base plate.

12. The semiconductor device of claim 1 , wherein the bulge portion is formed in the middle of the widthwise margin.

13. The semiconductor device of claim 1 , wherein the outer widthwise margin and the inner widthwise margin have different widths.

Assignees

• Yamamoto Kei
• Tada Kazuhiro
• Mitsubishi Electric Corp

Inventors

• Yamamoto Kei
• Tada Kazuhiro

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07331

  Connecting techniques · CPC title