Method for the Production of an Electronic Module as Well as Corresponding Electronic Module
US-2016329469-A1 · Nov 10, 2016 · US
US9320137B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9320137-B2 |
| Application number | US-201214125238-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 11, 2012 |
| Priority date | Jun 10, 2011 |
| Publication date | Apr 19, 2016 |
| Grant date | Apr 19, 2016 |
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Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.
Opening claim text (preview).
The invention claimed is: 1. A printed circuit board comprising: a flexible substrate divided into first, second, and third regions; a first rigid substrate in the first region of the flexible substrate; and a second rigid substrate in the third region of the flexible substrate, wherein a left lateral surface of the flexible substrate is aligned with a left lateral surface of the first rigid substrate, and a right lateral surface of the flexible substrate is aligned with a right la…
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