Method of making a low-Rdson vertical power MOSFET device

Patent metadata

Field	Value
Publication number	US-9318603-B2
Application number	US-201414201850-A
Country	US
Kind code	B2
Filing date	Mar 8, 2014
Priority date	Aug 23, 2011
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

The invention relates to a power semiconductor device and its preparation methods thereof. Particularly, the invention aims at providing a method for reducing substrate contribution to the Rdson (drain-source on resistance) of power MOSFETs, and a power MOSFET device made by the method. By forming one or more bottom grooves at the bottom of Si substrate, the on resistance of the power MOSFET device attributed to the substrate is effectively reduced. A matching lead frame base complementary to the substrate with bottom grooves further improves the package of the power MOSFET device.

First claim

The invention claimed is:

1. A method for making a low-Rdson vertical power MOSFET device in an epitaxial layer of a first conductivity type supported on a substrate with a bottom of the epitaxial layer configured as a bottom electrode of the vertical power MOSFET device comprises the following steps:
forming a lightly doped epitaxial layer on a lightly doped substrate;
forming a vertical MOSFET device in the epitaxial layer;
depositing a bottom passivation layer covering a bottom surface of the substrate;
forming a plurality of openings in the bottom passivation layer;
etching the substrate through the openings on the bottom passivation layer forming a plurality of grooves penetrating the substrate exposing portions of a bottom surface of the epitaxial layer;
depositing a metal layer covering the bottom surface of the substrate, sidewalls of the grooves and the exposed portions of the bottom surface of the epitaxial layer wherein the metal layer forming a bottom metal electrode of the vertical power MOSFET,
wherein the substrate being doped with a second conductivity type opposite to the first conductivity type of the epitaxial layer thus forming a PN junction at an interface of the substrate and the epitaxial layer therefore providing an etch stop when reversed bias to stop an electric-chemical etching process after etching the grooves through the substrate, and
wherein the method further comprising implanting dopant of the first conductivity type from the bottom of the substrate forming a plurality of heavily doped regions at the exposed portions of the bottom of the epitaxial layer corresponding to the grooves.

2. The method according to claim 1 wherein the substrate being doped with the first conductivity type; wherein an etching barrier layer being disposed between the substrate and the epitaxial layer, the etching barrier layer stopping a first etching process after using the openings on the bottom passivation layer to etch the grooves through the substrate, wherein the method further comprising a second etch etching through the barrier layer exposing portions of the epitaxial layer and implanting dopant of the first conductivity type from the bottom of the substrate forming a plurality of heavily doped regions at the exposed portions of the bottom of the epitaxial layer corresponding to the groove.

3. The method according to claim 1 wherein an etching barrier layer formed by a buried heavily doped layer being disposed between the substrate and the epitaxial layer.

4. The method according to claim 3 wherein the epitaxial layer being a lightly doped P type epitaxial layer and the vertical MOSFET being a P-channel trench MOSFET.

5. The method according to claim 3 wherein the buried heavily doped layer being a P− type heavily doped layer having a doping concentration of more than 1e19/cm3.

Assignees

• Alpha & Omega Semiconductor

Inventors

• Su Yi
• Ng Daniel
• Bhalla Anup
• Lu Jun

Classifications

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/07327

  involving guiding structures, e.g. spacers or supporting members · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title