Method for fabricating organic light emitting diode display device with improved effective emitting pixels area

Patent metadata

Field	Value
Publication number	US-9318542-B2
Application number	US-201314012321-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Nov 26, 2012
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.

First claim

What is claimed is:

1. A method of fabricating an organic light emitting diode display device, comprising:
forming a single layer first electrode directly contacting over a substrate including a display region, which includes a plurality of pixel regions, the single layer first electrode formed in each of the plurality of pixel regions;
forming a bank including a lower layer and an upper layer, the lower layer formed on edges of the single layer first electrode and having a first width and a first thickness, and the upper layer formed on the lower layer and having a second width smaller than the first width, wherein the forming of the bank includes:
applying directly a polymer material having a hydrophobic property by itself on the single layer first electrode to form a hydrophobic property bank material layer; and
patterning the hydrophobic property bank material layer to form the lower layer and the upper layer each having the hydrophobic property by itself;

forming an organic emitting layer directly contacting the single layer first electrode and directly contacting a portion of the lower layer; and
directly forming a single second electrode layer directly in contact with the entire organic emitting layer, the single second electrode layer covering an entire surface of the display region.

2. The method according to claim 1 , wherein the lower layer and the upper layer include a same material having a hydrophobic property.

3. The method according to claim 1 , wherein the first thickness is smaller than a thickness of the organic emitting layer and is within a range of about 0.2 to 1.5 micrometers.

4. The method according to claim 1 , wherein a width of the lower layer exposed outwards side surfaces of the upper layer is within a range of about 1 to 9 micrometers.

5. The method according to claim 1 , wherein the organic emitting layer on the portion of the lower layer has a flat top surface with the organic emitting layer on a center of the pixel region.

6. The method according to claim 5 , wherein forming the organic emitting layer includes:
applying a liquid phase organic emitting material using an ink-jet apparatus or a nozzle-coating apparatus; and
curing the organic emitting material to form the organic emitting layer.

7. The method according to claim 1 , wherein forming the bank includes:
forming a bank material layer on the first electrode by applying a polymer material having a hydrophobic property and a photosensitive property;
exposing the bank material layer to light through an exposing mask including a transmitting region, a blocking region and a half-transmitting region; and
patterning the bank material layer exposed to light.

8. The method according to claim 1 , wherein forming the bank includes:
forming a bank material layer on the first electrode by applying a polymer material having a hydrophobic property;
forming a photoresist layer on the bank material layer;
exposing the photoresist layer to light through an exposing mask including a transmitting region, a blocking region and a half-transmitting region;
developing the photoresist layer exposed to light to form a first photoresist pattern and a second photoresist pattern, the first photoresist pattern having a thickness larger than the second photoresist pattern;
patterning the bank material layer using the first and second photoresist patterns as an etching mask to form a bank pattern;
removing the second photoresist pattern by performing an ashing process to expose the bank pattern corresponding to the second photoresist pattern and to reduce the thickness of the first photoresist pattern;
anisotropically dry-etching the bank pattern using the first photoresist pattern having the reduced thickness as an etching mask to form the lower layer and the upper layer of the bank; and
stripping the first photoresist pattern to expose the upper layer of the bank.

9. The method according to claim 1 , wherein forming the bank includes:
forming a bank material layer on the first electrode by applying a polymer material having a hydrophobic property;
forming a photoresist layer on the bank material layer;
exposing the photoresist layer to light through an exposing mask including a transmitting region and a blocking region;
developing the photoresist layer exposed to light to form a first photoresist pattern;
patterning the bank material layer using the first photoresist pattern as an etching mask to form a bank pattern;
partially removing the first photoresist pattern by performing an isotropic ashing process to form a second photoresist pattern having a width and a thickness smaller than the first photoresist pattern and to expose the bank pattern outwards side surfaces of the second photoresist pattern;
anisotropically dry-etching the bank pattern using the second photoresist pattern as an etching mask to form the lower layer and the upper layer of the bank; and
stripping the second photoresist pattern to expose the upper layer of the bank.

10. The method according to claim 1 , wherein the organic emitting layer has a second thickness larger than the first thickness.

Assignees

• Lg Display Co Ltd

Inventors

• Choi Dae-Jung
• Lee Jae-Ki
• Yang Ki-Soub
• Seo Hwang-Un
• Jeon Hong-Myeong
• Choi Seung-Ryul
• Lee A-Ryoung
• Kim Han-Hee
• Lee Geum-Young
• Kim Kang-Hyun

Classifications

• H01L27/3246 Primary

  Electricity · mapped topic

• H01L27/3248

  Electricity · mapped topic

• H01L27/3262

  Electricity · mapped topic

• H01L51/5012

  Electricity · mapped topic

• H05B33/04 Primary

  Sealing arrangements {, e.g. against humidity} · CPC title