Semiconductor module having an integrated waveguide for radar signals

Patent metadata

Field	Value
Publication number	US-9318449-B2
Application number	US-201314382211-A
Country	US
Kind code	B2
Filing date	Jan 18, 2013
Priority date	Mar 2, 2012
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A semiconductor module, having an integrated circuit, a rewiring layer for externally connecting the integrated circuit, and at least one waveguide integrated into the semiconductor module for radar signals having a conductive pattern, which laterally surrounds the interior of the waveguides, the integrated circuit and the at least one waveguide being embedded, at least in regions, in a housing material of the semiconductor module; as well as a radar sensor, a motor vehicle radar system having such a semiconductor module, and a method for producing a semiconductor module.

First claim

What is claimed is:

1. A semiconductor module, comprising:
a housing layer;
an integrated circuit;
a rewiring layer for the external connection of the integrated circuit; and
at least one waveguide for radar signals and having a conductive pattern which laterally surrounds an interior of the waveguide;
wherein the integrated circuit and the at least one waveguide are embedded, at least in regions, in a housing material of the housing layer, wherein an open end of the conductive pattern of the at least one waveguide is situated on a surface of the semiconductor module, and wherein the open end is hollow and sized to accommodate an external waveguide.

2. The semiconductor module of claim 1 , wherein the integrated circuit includes a monolithic integrated microwave circuit.

3. The semiconductor module of claim 1 , further comprising:
a wafer unit; and
an interface layer;
wherein the wafer unit includes a semiconductor chip which forms the integrated circuit, and wherein the interface layer includes the rewiring layer, which connects the integrated circuit to external terminals of the interface layer.

4. The semiconductor module of claim 1 , wherein an interior of the at least one waveguide is filled with the housing material of the semiconductor module.

5. The semiconductor module of claim 1 , wherein the conductive pattern of the at least one waveguide has one or more electrically conductive walls, the one or more walls circumferentially surrounding the interior of the waveguide.

6. The semiconductor module of claim 1 , wherein the conductive pattern of the at least one waveguide includes at least one planar, closed wall section.

7. The semiconductor module of claim 1 , wherein the conductive pattern of the at least one waveguide includes at least one vertical wall section which is formed by a row of vertical conductor elements running in parallel to one another.

8. The semiconductor module of claim 1 , wherein the semiconductor module has at least one coupling element, which couples a waveguide to the integrated circuit for transmitting radar signals.

9. The semiconductor module of claim 1 , wherein the conductive pattern of the at least one waveguide is a conductor housing or a conductor cage.

10. A radar sensor, comprising:
a semiconductor module including a wafer unit and an interface layer;
wherein the wafer unit includes a semiconductor chip which forms the integrated circuit, and a housing layer, which is formed by a housing material of the semiconductor module and in which the semiconductor chip and the at least one waveguide are embedded, and wherein the interface layer includes a rewiring layer, which connects the integrated circuit to external terminals of the interface layer, wherein an open end of the conductive pattern of the at least one waveguide is situated on a surface of the semiconductor module, and wherein the open end is hollow and sized to accommodate an external waveguide.

11. A motor vehicle radar system, comprising:
a semiconductor module including a wafer unit and an interface layer;
wherein the wafer unit includes a semiconductor chip which forms the integrated circuit, and a housing layer, which is formed by a housing material of the semiconductor module and in which the semiconductor chip and at least one waveguide are embedded, and wherein the interface layer includes a rewiring layer, which connects the integrated circuit to external terminals of the interface layer, wherein an open end of the at least one waveguide is situated on a surface of the semiconductor module, and wherein the open end is hollow and sized to accommodate an external waveguide.

12. A method for producing a semiconductor module having at least one integrated waveguide for radar signals, the method comprising:
providing a semiconductor chip in the form of an integrated circuit; and
producing a housing layer of a housing of the semiconductor module that borders at least laterally on the semiconductor chip, at least one waveguide and the integrated circuit being embedded in a housing material of the housing layer which has a conductive pattern which laterally surrounds an interior of the waveguide, wherein an open end of the conductive pattern of the at least one waveguide is situated on a surface of the semiconductor module, and wherein the open end is hollow and sized to accommodate an external waveguide; and
producing a rewiring layer on at least one side of the housing layer.

13. The method of claim 12 , wherein the integrated circuit includes a monolithic integrated microwave circuit.

Assignees

• Hasch Juergen
• Wostradowski Uwe
• Gaier Stefan
• Pancera Elena
• Potratz Carsten
• Bosch Gmbh Robert

Inventors

• Hasch Juergen
• Wostradowski Uwe
• Gaier Stefan
• Pancera Elena
• Potratz Carsten

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/016

  using moulds · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W44/248

  for antennas · CPC title