Gallium nitride devices

Patent metadata

Field	Value
Publication number	US-9318417-B2
Application number	US-201514609784-A
Country	US
Kind code	B2
Filing date	Jan 30, 2015
Priority date	Dec 2, 2005
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others.

First claim

What is claimed is:

1. A transistor comprising a source electrode, a drain electrode and a gate electrode, said transistor further comprising:
a substrate;
a gallium nitride layer situated over said substrate;
a via that extends through at least a portion of said substrate;
a conductive layer on a back surface of said substrate;
said via coupling said conductive layer on said back surface of said substrate to a top-side contact formed over said substrate, said top-side contact overlying a field plate situated over a dielectric layer, said dielectric layer being interposed between said field plate and said source electrode.

2. The transistor of claim 1 , wherein said substrate comprises silicon.

3. The transistor of claim 1 , wherein said conductive layer comprises aluminum.

4. The transistor of claim 1 , wherein said conductive layer includes a first portion comprising gold and a second portion comprising aluminum.

5. The transistor of claim 1 further comprising a passivating layer situated over said gallium nitride layer.

6. The transistor of claim 1 , wherein said gate electrode is defined by an electrode-defining layer comprising silicon nitride.

7. The transistor of claim 1 further comprising a transition layer below said gallium nitride layer.

8. The transistor of claim 7 , wherein said transition layer is compositionally-graded.

9. A transistor comprising a source electrode, a drain electrode and a gate electrode, said transistor further comprising:
a substrate;
a silicon nitride layer situated over said substrate;
a gallium nitride layer situated over said silicon nitride layer;
a via that extends through at least a portion of said substrate;
a conductive layer on a back surface of said substrate;
said via coupling said conductive layer on said back surface of said substrate to a top-side contact formed over said substrate, said top-side contact situated over a portion of a field plate overlying a dielectric layer, said dielectric layer being interposed between said field plate and said source electrode.

10. The transistor of claim 9 , wherein said substrate comprises silicon.

11. The transistor of claim 9 , wherein said conductive layer comprises aluminum.

12. The transistor of claim 9 , wherein said conductive layer includes a first portion comprising gold and a second portion comprising aluminum.

13. The transistor of claim 9 further comprising a passivating layer situated over said gallium nitride layer.

14. The transistor of claim 9 , wherein said gate electrode is defined by an electrode-defining layer comprising silicon nitride.

15. The transistor of claim 9 further comprising a transition layer below said gallium nitride layer.

16. The transistor of claim 15 , wherein said transition layer is compositionally-graded.

Assignees

• Int Rectifier Corp
• Infineon Technologies Americas Corp

Inventors

• Therrien Robert Joseph
• Johnson Jerry Wayne
• Hanson Allen W

Classifications

• H10D62/8503

  Nitride Group III-V materials, e.g. AlN or GaN · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0234

  comprising etching via holes that stop on pads or on electrodes · CPC title

• H10W20/0242

  comprising etching via holes from the back sides of the chips, wafers or substrates · CPC title