Resin composition, prepreg and resin sheet and metal foil-clad laminate

Patent metadata

Field	Value
Publication number	US-9318402-B2
Application number	US-201214005920-A
Country	US
Kind code	B2
Filing date	Mar 22, 2012
Priority date	Mar 24, 2011
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.

First claim

The invention claimed is:

1. A resin composition comprising:
a polyphenylene ether (A);
a phosphorous-containing cyanate ester compound (B) represented by general formula (1):

wherein X 1 to X 8 represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, which may be the same or different from each other, and
Z represents a group represented by general formula (2):

wherein X 9 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, which may be the same or different from each other, and a represents an integer of 1 to 4, b represents an integer of 0 to 4, and m represents an integer of 1 to 4, or
a group represented by general formula (3):

wherein c represents an integer of 0 to 4, and n represents an integer of 1 to 3;
a non-halogenated epoxy resin (C);
a cyanate ester compound (D) other than the compound represented by the formula (1); and
a filler (E),
wherein a content of the filler (E) is 10 to 200 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components, and
wherein a content of the polyphenylene ether (A) is 50 to 90 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components.

2. The resin composition according to claim 1 , wherein the polyphenylene ether (A) is a polymer comprising at least a repeating unit represented by general formula (4):

wherein R 21 , R 22 , R 23 , and R 24 may be the same or different from each other, and represent an alkyl group having 6 or less carbon atoms, an aryl group, halogen, or hydrogen.

3. The resin composition according to claim 2 , wherein the polymer further comprises a repeating unit represented by general formula (5):

wherein R 1 , R 2 , R 3 , R 7 , and R 8 may be the same or different from each other, and are an alkyl group having 6 or less carbon atoms or a phenyl group, and R 4 , R 5 , and R 6 may be the same or different from each other, and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and/or
a repeating unit represented by general formula (6):

wherein R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , and R 16 may be the same or different from each other, and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and -A- is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

4. The resin composition according to claim 1 , wherein the polyphenylene ether (A) comprises a modified polyphenylene ether having an ethylenically unsaturated group at both ends.

5. The resin composition according to claim 4 , wherein the ethylenically unsaturated group is at least one selected from the group consisting of an alkenyl group, a cycloalkenyl group, and an alkenyl aryl group.

6. The resin composition according to claim 1 , wherein the polyphenylene ether (A) comprises a modified polyphenylene ether represented by general formula (7):

wherein —(O—X—O)—comprises a structure represented by general formula (8):

wherein R 1 , R 2 , R 3 , R 7 , and R 8 may be the same or different from each other, and are an alkyl group having 6 or less carbon atoms or a phenyl group, and R 4 , R 5 , and R 6 may be the same or different from each other, and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, or
general formula (9):

wherein R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , and R 16 may be the same or different from each other, and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and -A- is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms, and —(Y—O)—is represented by general formula (10):

wherein R 17 and R 18 may be the same or different from each other, and are an alkyl group having 6 or less carbon atoms or a phenyl group, and R 19 and R 20 may be the same or different from each other, and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and
a sequence of the —(Y—O)—units comprises one —(Y—O)—unit or two or more different —(Y—O)—units arranged randomly, and a and b represent an integer of 0 to 100, with at least either of a and b being not 0.

7. The resin composition according to claim 1 , wherein a number average molecular weight of the polyphenylene ether (A) is 500 to 3000.

8. The resin composition according to claim 1 , wherein the phosphorus-containing cyanate ester compound (B) is a compound wherein, in formula (1), X 1 to X 8 are a hydrogen atom or a methyl group, which may be the same or different from each other, Z represents a group represented by formula (2), X 9 is a hydrogen atom, an alkyl group, or an aryl group, a is 1 to 4, b is 0 to 2, and m is 1 to 2.

9. The resin composition according to claim 1 , wherein the phosphorus-containing cyanate ester compound (B) is a compound represented by formula (11):

10. The resin composition according to claim 1 , wherein a content of the phosphorus-containing cyanate ester compound (B) is 10 to 25 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components.

11. The resin composition according to claim 1 , wherein the non-halogenated epoxy resin (C) is at least one selected from the group consisting of a naphthalene modified epoxy resin, a biphenyl aralkyl-based epoxy resin, and a cresol novolac -based epoxy resin.

12. The resin composition according to claim 1 , wherein a content of the non-halogenated epoxy resin (C) is 1 to 15 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components.

13. The resin composition according to claim 1 , wherein the cyanate ester compound (D) is a bisphenol A-based cyanate ester resin or a naphthol aralkyl-based cyanate ester resin.

14. The resin composition according to claim 1 , wherein a content of the cyanate ester compound (D) is 1 to 15 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components.

15. A prepreg obtained by impregnating or coating a base material with the resin composition according to claim 1 .

16. A metal foil-clad laminate obtained by stacking at least one prepreg according to claim 15 , disposing a metal foil on one surface or both surfaces of the prepreg or the stacked prepregs, and lamination-m

Assignees

• Yaginuma Michio
• Ito Shoichi
• Ueno Yoshitaka
• Mitsubishi Gas Chemical Co

Inventors

• Yaginuma Michio
• Ito Shoichi
• Ueno Yoshitaka

Classifications

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08J2371/02

  Polyalkylene oxides · CPC title

• B32B2260/046

  Synthetic resin · CPC title

• B32B2305/076

  Prepregs · CPC title