Wafer-scale package including power source

Patent metadata

Field	Value
Publication number	US-9318400-B2
Application number	US-201414186039-A
Country	US
Kind code	B2
Filing date	Feb 21, 2014
Priority date	Oct 26, 2010
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

First claim

The invention claimed is:

1. A device comprising:
a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;
a second substrate that includes at least one of a second semiconductor material and a second insulating material, the second substrate bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates; and
a battery housed in the enclosed cavity, the battery including conductive contacts disposed on a bottom surface of the battery, the conductive contacts soldered to two or more of the plurality of bonding pads such that the bottom surface of the battery faces the surface of the first substrate that includes the bonding pads.

2. The device of clam 1 , further comprising a control module disposed within the enclosed cavity, wherein the control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient, and wherein the battery provides power to the control module.

3. The device of claim 1 , wherein the first and second substrates include glass substrates.

4. The device of claim 3 , wherein the bond between the first and second substrates includes silicon.

5. The device of claim 3 , wherein the bond between the first and second substrates includes a light absorbing material, and wherein the light absorbing material absorbs light at a wavelength that is transmitted by one of the first and second substrates.

6. The device of claim 1 , wherein one of the first and second substrates includes a silicon substrate, and wherein the other of the first and second substrates includes a glass substrate.

7. The device of claim 1 , wherein the battery includes a solid state battery.

8. The device of claim 1 , further comprising an integrated circuit in the enclosed cavity, wherein at least a portion of the control module is included on the integrated circuit, and wherein the battery is mounted on the first substrate such that the battery straddles at least a portion of the integrated circuit.

9. A device comprising:
a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;
a second substrate that includes at least one of a second semiconductor material and a second insulating material, the second substrate bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates; and
a battery housed in the enclosed cavity, the battery including conductive contacts on a bottom surface of the battery, wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the bottom surface of the battery faces the surface of the first substrate that includes the bonding pads.

10. The device of claim 9 , further comprising an integrated circuit fabricated on one of the first and second substrates, wherein the battery is configured to provide power to the integrated circuit.

11. The device of claim 10 , further comprising a sensor, wherein the sensor is connected to the integrated circuit, and wherein the sensor includes one of a temperature sensor, a pressure sensor, an accelerometer, and a gyroscopic sensor.

12. A device comprising:
a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;
a second substrate that includes at least one of a second semiconductor material and a second insulating material, wherein the second substrate defines a recessed region; and
a battery that is fabricated in the recessed region defined by the second substrate, the battery including conductive contacts fabricated on a surface of the battery, wherein the second substrate is bonded to the first substrate such that the first and second substrates enclose the battery, and wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the surface of the battery including the conductive contacts faces the surface of the first substrate that includes the bonding pads.

Assignees

• Medtronic Inc

Inventors

• O'Brien Richard J
• Day John K
• Gerrish Paul F
• Mattes Michael F
• Ruben David A
• Grief Malcolm K

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title