Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9316910B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9316910-B2 |
| Application number | US-201213406306-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2012 |
| Priority date | Feb 28, 2011 |
| Publication date | Apr 19, 2016 |
| Grant date | Apr 19, 2016 |
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Provided is a pattern forming method that is excellent in roughness performance such as line width roughness and exposure latitude, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin that includes 65 mol % or more of a repeating unit having a group which generates a polar group by being degraded by the action of an acid based on all repeating units in the resin and at least one kind of repeating unit represented by the following General Formula (I) or (II), (2) exposing the film, and (3) developing the exposed film using a developer that contains an organic solvent.
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What is claimed is: 1. A pattern forming method comprising: (1) forming a film by using an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin that includes; 65 mol % or more of a repeating unit represented by the following General Formula (AI) as a repeating unit having a group which generates a polar group by being degraded by the action of an acid based on all repeating units in the resin, and at least one kind of repeating unit represented by the following General Formula (I) or (II); (2) exposing the film; and (3) developing the exposed film using a developer that contains an organic solvent: wherein in General Formula (AI), Xa 1 represents a hydrogen atom, a methyl group which may have a substituent, or a group represented by —CH 2 —R 9 , where R 9 represents a hydrogen atom or a monovalent organic group; T represents a single bond; and each of Rx 1 to Rx 3 independently represents an alkyl group or a cycloalkyl group; and two or more of Rx 1 to Rx 3 may form a cycloalkyl group by binding to each other, wherein in General Formulae (I) and (II), each of R 11 and R 21 independently represents a hydrogen atom or an alkyl group; each of R 12 and R 22 independently represents an alkyl group, a cycloalkyl group, an alkoxy group, an alkoxycarbonyl group, a carboxyl group, a halogen atom, a hydroxyl group, or a cyano group; each of R 13 and R 23 independently represents an alkylene group, a cycloalkylene group, or a combination thereof, provided that when a plurality of R 13 s are present, each R 13 may be the same as or different from each other, and provided that when a plurality of R 23 s are present, each R 23 may be the same as or different from each other; each of Y 1 and Y 2 independently represents a single bond, an ether bond, an ester bond, an amide bond, a urethane bond, or a ureylene bond, provided that when a plurality of Y 1 s are present, each Y 1 may be the same as or different from each other, and provided that when a plurality of Y 2 s are present, each Y 2 may be the same as or different from each other; each of X 1 and X 2 independently represents a methylene group, a methyl methylene group, a dimethyl methylene group, an ethylene group, an oxygen atom, or a sulfur atom, each of m1 and m2 independently represents an integer of 0 to 4; each of n1 and n2 independently represents an integer of 0 to 4, provided that when n1 is 2 or greater, a plurality of R 12 s may be the same as or different from each other or may form a ring by binding to each other, and provided that when n2 is 2 or greater, a plurality of R 22 s may be the same as or different from each other or may form a ring by binding to each other. 2. The pattern forming method according to claim 1 , wherein the content of the organic solvent in the developer is 90% by mass to 100% by mass based on the total amount of the developer. 3. The pattern forming method according to claim 1 , wherein the resin contains, as the repeating unit having a group which generates a polar group, 50 mol % or more of a repeating unit generating an eliminated substance having a molecular weight of 140 or less by the action of an acid, based on all repeating units in the resin. 4. The pattern forming method according to claim 1 , wherein the resin further contains a repeating unit having a hydroxyl adamantyl group or a dihydroxy adamantyl group. 5. The pattern forming method according to claim 1 , wherein the resin does not have an acid group. 6. The pattern forming method according to claim 1 , wherein the actinic-ray-sensitive or radiation-sensitive resin composition further contains a hydrophobic resin. 7. The pattern forming method according to claim 6 , wherein the hydrophobic resin contains at least any one of a fluorine atom and a silicon atom. 8. The pattern forming method according to claim 1 , wherein the developer contains at least one kind of organic solvent selected from a group consisting of a ketone-based solvent, an ester-based solvent, an alcohol-based solvent, an amide-based solvent, and an ether-based solvent. 9. The pattern forming method according to claim 1 , further comprising (4) washing the developed film using a rinsing liquid containing an organic solvent. 10. The pattern forming method according to claim 1 , wherein the exposing in (2) is liquid immersion exposure. 11. The pattern forming method according to claim 1 , wherein m1 in the General Formula (I) represents 0. 12. The pattern forming method according to claim 1 , wherein the repeating unit represented by General Formula (AI) is at least one of a repeating unit represented by the following General Formula (1) and a repeating unit represented by the following General Formula (2): wherein in General Formulae (1) and (2), each of R 1 and R 3 independently represents a hydrogen atom, a methyl group which may have a substituent, or a group represented by —CH—R 9 , where R 9 represents a hydroxyl group or a monovalent organic group; each of R 2 , R 4 , R 5 , and R 6 independently represents an alkyl group or a cycloalkyl group; and R represents an atomic group that is necessary for forming an alicyclic structure with a carbon atom. 13. The pattern forming method according to claim 1 , wherein the actinic-ray-sensitive or radiation-sensitive resin composition further contains a nitrogen-containing organic compound having a group eliminated by the action of an acid represented by the following General Formula (F); in General Formula (F), R a represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, when n=2, two R a s may be the same as or different from each other, and the two R a s may form a divalent heterocyclic hydrocarbon group or a derivative thereof by binding to each other, R b independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, in —C(R b )(R b )(R b ), when one or more R b s are hydrogen atoms, at least one of the remaining R b s is a cyclopropyl group or a 1-alkoxyalkyl group, at least two R b s may form an alicyclic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic hydrocarbon group, or a derivative thereof by binding to each other, n represents an integer of 0 to 2, m represents an integer of 1 to 3, and n+m=3. 14. The pattern forming method according to claim 1 , wherein the repeating unit represented by the General Formula (AI) is at least one repeating unit selected from the group consisting of repeating units represented by the following General Formulas: wherein in the General Formulas, Xa 1 represents a hydrogen atom, CH 3 , CF 3 , or CH 2 OH. 15. A pattern forming method comprising: (1) forming a film by using an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin that includes: 65 mol % or more of a repeating unit havin
the macromolecular compound having an alicyclic moiety in a side chain · CPC title
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