Temperature sensor and temperature sensor attaching structure

Patent metadata

Field	Value
Publication number	US-9316546-B2
Application number	US-201313933349-A
Country	US
Kind code	B2
Filing date	Jul 2, 2013
Priority date	Jan 7, 2011
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A flexible board includes a base layer, a wiring conductor layer that is located on the base layer, and a cover layer that is stacked over the base layer and covers the wiring conductor layer. A portion of the wiring conductor layer defines connecting portions that connect each of split electrodes of a flexible thermistor. The cover layer includes an opening that exposes the connecting portions, and receives the flexible thermistor. The split electrodes of the flexible thermistor are mounted on the connecting portions of the wiring layer. The height of the exposed surface of the flexible thermistor from the opening is substantially equal to the height of the surface of the cover layer.

First claim

What is claimed is:

1. A temperature sensor comprising:
a flexible thermistor that includes:
a metal base;
a thermistor layer that is located on the metal base, the thermistor layer being thinner than the metal base; and
a pair of split electrodes that are located on the thermistor layer; and

a flexible board that includes:
a base layer;
a wiring conductor layer that is located on the base layer; and
a cover layer that is stacked over the base layer and covers the wiring conductor layer; wherein

the cover layer includes an opening through which a portion of the wiring conductor layer is exposed;
the flexible thermistor is received within the opening, and the split electrodes of the flexible thermistor are electrically connected to the wiring conductor layer that is exposed from the opening; and
a height of a surface of the cover layer is substantially the same as a height of an exposed surface of the flexible thermistor.

2. The temperature sensor according to claim 1 , wherein the height of the surface of the cover layer becomes the same as the height of the exposed surface of the flexible thermistor when the temperature sensor is pressed in a thickness direction with respect to the flexible board.

3. The temperature sensor according to claim 1 , wherein the height of the exposed surface of the flexible thermistor is within a range of about ±20% with respect to the height of the surface of the cover layer.

4. A temperature sensor attaching structure comprising the temperature sensor according to claim 1 , wherein the temperature sensor is arranged so that the metal base of the flexible thermistor is adjacent to or contacts with a temperature detection object.

5. The temperature sensor according to claim 1 , wherein the opening is rectangular or substantially rectangular.

6. The temperature sensor according to claim 1 , wherein a mounting surface of the flexible thermistor is flat.

7. The temperature sensor according to claim 1 , wherein a thickness of the base layer is larger at an area where the wiring conductor layer is not located.

8. The temperature sensor according to claim 1 , wherein a projection is provided on a surface of the base layer and has a thickness equal to or substantially equal to a thickness of the wiring conductor layer.

9. A temperature detection object comprising the temperature sensor according to claim 1 , wherein the flexible thermistor is arranged to contact the temperature detection objection.

10. The temperature detection object according to claim 9 , wherein the temperature detection object is a battery and the temperature sensor is wound around the battery.

11. The temperature sensor according to claim 1 , wherein the flexible thermistor includes an insulating protective layer arranged around the flexible thermistor and plating layers are provided on the split electrodes.

12. The temperature sensor according to claim 1 , wherein the flexible board includes at least two of the base layer and at least two of the wiring conductor layer.

13. An RFID tag including the temperature sensor according to claim 1 .

14. The RFID tag according to claim 13 , wherein the flexible board is an RFID board.

15. The RFID tag according to claim 13 , wherein a lower surface of the base layer of the flexible boar is affixed to a temperature detection object.

16. The RFID tag according to claim 13 , wherein RFID tag is one of a label for a food item or a beverage, a sticker to be affixed to a human body or animal body, a sensor for a high temperature hazardous area, and a sticker to an object.

17. A battery pack including the temperature sensor according to claim 1 .

18. The battery pack according to claim 17 , wherein at least two of the flexible thermistor are provided on the flexible board.

19. The battery pack according to claim 17 , further comprising at least two batteries with the temperature sensor arranged therebetween.

20. An electronic apparatus comprising:
a heat generating element that is a temperature detection object;
a radiator that radiates heat of the temperature detection object; and
the temperature sensor according to claim 1 arranged to detect the heat of the temperature detection object radiated by the radiator.

Assignees

• Murata Manufacturing Co

Inventors

• Tsubaki Shuji
• Haga Takeo
• Miyagawa Kazuto

Classifications

• H01M10/486

  for measuring temperature · CPC title

• H01M50/569

  Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals (battery terminal connectors with integrated measuring arrangements G01R31/364) · CPC title

• G06K19/07749

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G01K1/14

  Supports; Fastening devices; Arrangements for mounting thermometers in particular locations · CPC title

• G01K7/22 Primary

  the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) · CPC title