Polyamide ester resin, method of preparing the same, and molded article including the same

US9315627B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9315627-B2
Application numberUS-201314103875-A
CountryUS
Kind codeB2
Filing dateDec 12, 2013
Priority dateMay 31, 2013
Publication dateApr 19, 2016
Grant dateApr 19, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.

First claim

Opening claim text (preview).

What is claimed is: 1. A polyamide ester resin comprising a polymer of: a dicarboxylic acid comprising an aromatic dicarboxylic acid; a diamine comprising a linear aliphatic diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. 2. The polyamide ester resin according to claim 1 , wherein the dicarboxylic acid further comprises C 8 to C 20 alicyclic dicarboxylic acid. 3. The polyamide ester resin according to claim 1 , wherein the diamine comprises at least one of C 4 to C 20 linear aliphatic diamines. 4. The polyamide ester resin according to claim 1 , wherein the linear aliphatic diol comprises at least one of C 2 to C 20 linear aliphatic diols. 5. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a glass transition temperature (Tg) from about 80° C. to about 120° C. 6. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has an intrinsic viscosity from about 0.5 dL/g to about 1.0 dL/g. 7. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a color change (ΔE) of from about 5 to about 10 as calculated by Equation 1: Color change (Δ E )=√{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}  (1) wherein ΔL* is a difference between L* values before and after scorch testing, Δa* is a difference between a* values before and after scorch testing, and Δb* is a difference between b* values before and after scorch testing, in which about 1 g to about 3 g of the polyamide ester resin is left in a convection oven at about 200° C. for about 1 hour. 8. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a terminal group encapsulated with an end capping agent comprising an aliphatic carboxylic acid, an aromatic carboxylic acid, or a mixture thereof. 9. The polyamide ester resin according to claim 8 , wherein the end capping agent comprises acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid, benzoic acid, toluic acid, α-naphthalene carboxylic acid, β-naphthalene carboxylic acid, methylnaphthalene carboxylic acid, or a mixture thereof. 10. A method of preparing a polyamide ester resin, comprising: polymerizing a dicarboxylic acid comprising an aromatic dicarboxylic acid, a diamine comprising a linear aliphatic diamine and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290°. 11. A molded article comprising the polyamide ester resin according to claim 1 . 12. The molded article according to claim 11 , wherein the molded article is an LED reflector.

Assignees

Inventors

Classifications

  • Reflecting means · CPC title

  • Polyester-amides · CPC title

  • Mirrors {(vehicle mirrors involving special optical features B60R1/08)} · CPC title

  • Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00) · CPC title

  • C08G69/44Primary

    Polyester-amides · CPC title

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What does patent US9315627B2 cover?
A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting po…
Who is the assignee on this patent?
Cheil Ind Inc
What technology area does this patent fall under?
Primary CPC classification C08G69/44. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).