Sandwich panels

US9314992B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9314992-B2
Application numberUS-201113521808-A
CountryUS
Kind codeB2
Filing dateJan 17, 2011
Priority dateJan 20, 2010
Publication dateApr 19, 2016
Grant dateApr 19, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A structural panel comprising an internal core material having first and second opposing faces, first and second face sheets bonded to the first and second opposing faces respectively, wherein the panel comprises an open-structured sheet, interposed between a first face of the core material and its respective face sheet and the panel comprises less than 200 gsm adhesive.

First claim

Opening claim text (preview).

The invention claimed is: 1. An uncured structural sandwich panel comprising: a honeycomb core having first and second opposing faces; a first prepreg face sheet that is located next to the first face of said honeycomb core, said first prepreg sheet comprising carbon fibers and an uncured thermosetting resin comprising epoxy resin, polyethersulphone and a curing agent for said epoxy resin wherein the amount of uncured thermosetting resin in said first prepreg face sheet is equal to at least 44 weight percent, based on the total weight of said first prepreg face sheet; and a first open-structured sheet that is interposed between the first face of said honeycomb core and said first prepreg face sheet, said first open-structured sheet weighing from 10 to 30 grams per square meter and consisting of polyethylene terephthalate. 2. The uncured structural sandwich panel according to claim 1 , which comprises: a second prepreg face sheet that is located next to the second face of said honeycomb core, said second prepreg sheet comprising carbon fibers and an uncured thermosetting resin comprising epoxy resin, polyethersulphone and a curing agent for said epoxy resin wherein the amount of uncured thermosetting resin in said second prepreg sheet is equal to at least 44 weight percent, based on the total weight of said second prepreg face sheet; and a second open-structured sheet that is interposed between the second face of said honeycomb core and said second prepreg face sheet, said second open-structured sheet weighing from 10 to 30 grams per square meter and consisting of polyethylene terephthalate. 3. The uncured structural sandwich panel according to claim 2 , wherein the second open-structured sheet has a degree of openness of from 50 to 80%. 4. The uncured structural sandwich panel according to claim 2 wherein the amount of uncured thermosetting resin in said second prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said second prepreg face sheet. 5. The uncured structural sandwich panel according to claim 4 wherein the amount of uncured thermosetting resin in said first prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said first prepreg face sheet. 6. A structural sandwich panel which comprises the uncured structural sandwich panel according to claim 2 wherein said uncured thermosetting resin in said first prepreg face sheet has been cured to form cured thermosetting resin that has migrated through said first open-structured sheet into bonding contact with the first face of said honeycomb core and wherein said uncured thermosetting resin in said second prepreg face sheet has been cured to form cured thermosetting resin that has migrated through said second open-structured sheet into bonding contact with the second face of said honeycomb core. 7. The structural sandwich panel according to claim 6 wherein the amount of uncured thermosetting resin in said second prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said second prepreg face sheet. 8. The structural sandwich panel according to claim 7 wherein the amount of uncured thermosetting resin in said first prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said first prepreg face sheet. 9. An aircraft structural panel which comprises the structural sandwich panel according to claim 6 . 10. The uncured structural sandwich panel according to claim 1 wherein the first open-structured sheet has a degree of openness of from 50 to 80%. 11. The uncured structural sandwich panel according to claim 1 wherein the amount of uncured thermosetting resin in said first prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said first prepreg face sheet. 12. A structural sandwich panel which comprises the uncured structural sandwich panel according to claim 1 wherein said uncured thermosetting resin in said first prepreg face sheet has been cured to form a cured thermosetting resin that has migrated through said first open-structured sheet into bonding contact with the first face of said honeycomb core. 13. The structural sandwich panel according to claim 12 wherein the amount of uncured thermosetting resin in said first prepreg face sheet is equal to at least 50 weight percent, based on the total weight of said first prepreg face sheet. 14. An aircraft structural panel which comprises the structural sandwich panel according to claim 12 .

Assignees

Inventors

Classifications

  • Interconnection of layers · CPC title

  • Particles made of materials belonging to B32B27/00 · CPC title

  • Weight, e.g. weight per square meter · CPC title

  • Woven fabric · CPC title

  • Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.] · CPC title

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Frequently asked questions

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What does patent US9314992B2 cover?
A structural panel comprising an internal core material having first and second opposing faces, first and second face sheets bonded to the first and second opposing faces respectively, wherein the panel comprises an open-structured sheet, interposed between a first face of the core material and its respective face sheet and the panel comprises less than 200 gsm adhesive.
Who is the assignee on this patent?
Mortimer Steve, Legoff Emille, Germain Bertrand, and 4 more
What technology area does this patent fall under?
Primary CPC classification B32B3/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).