Direct coolant contact vapor condensing

Patent metadata

Field	Value
Publication number	US-9313920-B2
Application number	US-201314058546-A
Country	US
Kind code	B2
Filing date	Oct 21, 2013
Priority date	Oct 21, 2013
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.

First claim

What is claimed is:

1. A cooling apparatus comprising:
a vapor condenser, the vapor condenser comprising:
a condenser housing comprising a condensing chamber accommodating a working fluid and a coolant, the working fluid and the coolant being in direct contact within the condensing chamber and being immiscible fluids, and the condensing chamber comprising a working fluid vapor layer and a working fluid liquid layer;
a working fluid vapor inlet and a working fluid liquid outlet, the working fluid vapor inlet facilitating flow of working fluid vapor into the condensing chamber, and the working fluid liquid outlet facilitating egress of working fluid liquid from the condensing chamber;
a coolant inlet structure and a coolant outlet structure, the coolant inlet structure facilitating ingress of the coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing of the working fluid vapor into the working fluid liquid and thereby transfer heat from the working fluid vapor to the coolant, and the coolant outlet structure facilitating subsequent egress of the coolant from the condensing chamber of the condenser housing; and
wherein the coolant outlet structure comprises a coolant outlet manifold with a plurality of coolant outlet openings, the coolant outlet manifold being disposed, at least partially, within the condensing chamber in a coolant layer within the condensing chamber, between the working fluid vapor layer and the working fluid liquid laver.

2. The cooling apparatus of claim 1 , wherein the coolant inlet structure comprises a coolant inlet manifold with a plurality of coolant inlet openings distributed within the condensing chamber and introducing, the coolant into the working fluid vapor layer within the condensing chamber of the condenser housing.

3. The cooling apparatus of claim 1 , wherein the coolant inlet, structure comprises a coolant inlet manifold with ,a plurality of spray nozzles or a plurality of jet nozzles associated therewith and distributed within the condensing chamber for introducing the coolant into the working fluid vapor layer of the condensing chamber.

4. The cooling apparatus of claim 1 , further comprising a coolant-working fluid separation baffle disposed, at least partially, over the coolant outlet manifold, the coolant-working fluid separation baffle facilitating directing condensed working fluid liquid drops through the coolant layer to the working fluid liquid layer of the condensing chamber.

5. The cooling apparatus of claim 4 , wherein the coolant-working fluid separation baffle comprises a plurality of fluid pass-through openings, the plurality of fluid pass-through openings being located in the condensing chamber at a height below the coolant outlet manifold.

6. The cooling apparatus of claim 5 , wherein the plurality of fluid pass-through openings of the coolant-working fluid separation baffle reside within the working fluid liquid layer of the condensing chamber, and the coolant is less dense than the working fluid liquid.

7. The cooling apparatus of claim 5 , wherein the coolant comprises an aqueous-based coolant, and the working fluid comprises a dielectric fluid.

8. The cooling apparatus of claim 7 , further comprising a dielectric-fluid-phobic filtration material positioned to facilitate separating the coolant and the working fluid liquid, while allowing removal of the coolant from the condensing chamber through the coolant outlet manifold.

9. The cooling apparatus of claim 8 , wherein the plurality of liquid pass-through openings in the coolant-working fluid separation baffle are within the working fluid liquid layer of the condensing chamber, and the dielectric-fluid-phobic filtration material is disposed in at least one coolant flow path between the plurality of fluid pass-through openings and the coolant outlet manifold.

10. A coolant-cooled electronic system comprising:
an electronic system cooled, at least in part, by a working fluid boiling within an electronic system housing and
a cooling apparatus comprising a vapor condenser in fluid communication with the electronic system housing to facilitate transfer of the working fluid therebetween, the vapor condenser comprising;
a condenser housing comprising a condensing chamber accommodating the working fluid and a coolant, the working fluid and the coolant being in direct contact within the condensing chamber and being immiscible fluids, and the condensing chamber comprising a working fluid vapor layer and a working fluid liquid layer;
a working fluid vapor inlet and a working fluid liquid outlet, the working fluid vapor inlet facilitating flow of working fluid vapor into the condensing chamber from the electronic system housing, and the working fluid liquid outlet facilitating egress of working fluid liquid from the condensing chamber for return to the electronic system housing;
a coolant inlet structure and a coolant outlet structure, the coolant inlet structure facilitating ingress of the coolant into a working fluid layer region of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing of the working fluid vapor into the working fluid liquid and thereby transfer of heat from the working fluid vapor to the coolant, and the coolant outlet structure facilitating subsequent egress of coolant from the condensing chamber of the condenser housing; and
wherein the coolant outlet structure is disposed. at least partially, within the condensing chamber in a coolant layer within the condensing chamber, between the working fluid vapor layer and the working fluid liquid layer.

11. The coolant-cooled electronic system of claim 10 , wherein the coolant inlet structure comprises a coolant inlet manifold with a plurality of spray or jet nozzles distributively introducing the coolant into the working fluid vapor layer of the condensing chamber.

12. The coolant-cooled electronic system of claim 10 , further comprising a coolant-working fluid separation baffle disposed, at least partially, over the coolant outlet structure, the coolant-working fluid separation baffle facilitating directing condensed working fluid liquid drops through the coolant layer to the working fluid liquid layer of the condensing chamber.

13. The coolant-cooled electronic system of claim 12 , wherein the coolant-working fluid separation baffle comprises a plurality of fluid pass-through openings, the plurality of fluid pass-through openings being located in the condensing chamber at a height below the coolant outlet structure.

14. The coolant-cooled electronic system of claim 13 , wherein the plurality of fluid pass-through openings of the coolant-working fluid separation baffle reside within the working fluid liquid layer of the condensing chamber, and the coolant is less dense than the working fluid liquid.

15. The coolant-cooled electronic system of claim 13 , wherein the coolant comprises an aqueous-based coolant, and the working fluid comprises a dielect ic fluid, and wherein the vapor condenser further comprises a dielectric-fluid-phobic filtration material positioned within the condensing chamber to facilitate separating the coolant and the working fluid liquid, while allowing removal of the coolant from the condensing chamber through the coolant outlet structure.

16. The coolant-cooled electronic system of claim 10 , wherein the electronic system comprises an immersion-cooled electronic system with a plurality of electronic components at least partially immersion-cooled within the electronic system housing via a dielectric

Assignees

• IBM

Inventors

• Campbell Levi A
• Chu Richard C
• David Milnes P
• Demetriou Dustin W
• Ellsworth Jr Michael J
• Iyengar Madhusudan K
• Schmidt Roger R
• Simons Robert E

Classifications

• F28B3/04

  by injecting cooling liquid into the steam or vapour (F28B3/08 takes precedence) · CPC title

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• F25B23/006

  boiling cooling systems · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title