Method and system for localized heat treating using susceptor

US9313832B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9313832-B2
Application numberUS-201213656982-A
CountryUS
Kind codeB2
Filing dateOct 22, 2012
Priority dateOct 22, 2012
Publication dateApr 12, 2016
Grant dateApr 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system or method for heat treating a localized area of a component part includes providing a susceptor, shaping the susceptor to conform to the component part, a component part, and a heat source, heating the susceptor by the heat source, and introducing the susceptor to the desired target area of the component part for a controlled or predetermined interval as necessary to achieve a desired metallurgical effect to take place with respect to the desired target area.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for heat treating a localized area of a component part, comprising: providing a susceptor, a component part, and a heat source; shaping the susceptor to include a feature corresponding to a negative impression of a desired target area of the component part; heating the susceptor by the heat source separately from the component part; controlling the temperature of the susceptor to a predetermined temperature suitable for heat treatment of the desired target area of the component part prior to introducing the susceptor to the component part; and applying the susceptor to the desired target area of the component part after the susceptor reaches the predetermined temperature for a controlled or predetermined interval as is necessary to achieve a desired metallurgical effect to take place with respect to the desired target area. 2. The method of claim 1 , wherein shaping comprises shaping the susceptor to conform to the component part. 3. The method of claim 1 , wherein shaping comprises shaping the susceptor as a negative impression of least a portion of a profile of the component part. 4. The method of claim 1 , further comprising sizing the susceptor for heating a desired target area of the component part. 5. The method of claim 4 , wherein heating is achieved without affecting properties of the component part adjacent to the targeted area. 6. The method of claim 1 , further comprising applying heat shielding to areas of the component part adjacent to the target area. 7. The method of claim 1 , further comprising applying local cooling to areas of the component part adjacent to the target area. 8. The method of claim 1 , further comprising controlling and separating the target area of the component part from an adjacent area of component part in which heat treating is not intended. 9. The method of claim 1 , further comprising providing a plurality of grooves in the susceptor, each groove comprising a negative impression of a target area of a plurality of component parts. 10. The method of claim 9 , wherein the plurality of component parts is heat treated with the susceptor. 11. The method of claim 9 , wherein multiple shapes are treated with the susceptor.

Assignees

Inventors

Classifications

  • H05B6/105Primary

    using a susceptor · CPC title

  • using radiation {, e.g. electro-magnetic waves, induction heating} · CPC title

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What does patent US9313832B2 cover?
A system or method for heat treating a localized area of a component part includes providing a susceptor, shaping the susceptor to conform to the component part, a component part, and a heat source, heating the susceptor by the heat source, and introducing the susceptor to the desired target area of the component part for a controlled or predetermined interval as necessary to achieve a desired …
Who is the assignee on this patent?
Gen Electric, Harsco Corp
What technology area does this patent fall under?
Primary CPC classification H05B6/105. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).