Electronic apparatus
US-12165552-B2 · Dec 10, 2024 · US
US9312423B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9312423-B2 |
| Application number | US-201414284406-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 22, 2014 |
| Priority date | May 24, 2013 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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A photo detector and a method for fabricating the same are provided. The photo detector includes a first substrate and a photo conversion element. The first substrate has a sensor element array for receiving a light with a spectrum in a specific wavelength range. The photo conversion element is disposed on the sensor element array, where the photo conversion element includes a photo conversion material layer and a doped photo conversion material column structure layer. A luminescent spectrum of the doped photo conversion material layer column structure layer is overlapped with the spectrum in a specific wavelength range, and a luminescent spectrum of the photo conversion material layer is non-overlapped with the spectrum in a specific wavelength range.
Opening claim text (preview).
What is claimed is: 1. A photo detector, comprising: a first substrate, having a sensor element array for receiving light with a spectrum in a specific wavelength range; a photo conversion element, disposed on the sensor element array, wherein the photo conversion element comprises a photo conversion material layer and a doped photo conversion material column structure layer, a luminescent spectrum of the doped photo conversion material column structure layer is overlapped with the spectrum in the specific wavelength range, and a luminescent spectrum of the photo conversion material layer is non-overlapped with the spectrum in the specific wavelength range; and a second substrate disposed opposite to the first substrate, wherein the photo conversion element is disposed on the second substrate, a reflective layer is further disposed between the second substrate and the photo conversion element, and the photo conversion material layer is located between the reflective layer and the doped photo conversion material column structure layer. 2. The photo detector as claimed in claim 1 , wherein the photo detector comprises an X-ray detector. 3. The photo detector as claimed in claim 1 , wherein the sensor element array comprises an amorphous silicon photodiode, and the spectrum in the specific wavelength range of the amorphous silicon photodiode is substantially between 450 nm and 620 nm. 4. The photo detector as claimed in claim 1 , wherein a material of the photo conversion material layer comprises pure cesium iodide, and a luminescent spectrum of the pure cesium iodide is substantially between 290 nm and 340 nm. 5. The photo detector as claimed in claim 1 , wherein a thickness of the photo conversion material layer is substantially between 10 μm and 100 μm, and a thickness of the doped photo conversion material column structure layer is substantially between 100 μm and 1000 μm. 6. The photo detector as claimed in claim 1 , wherein a material of the doped photo conversion material column structure layer comprises cesium iodide doped with thallium or cesium iodide doped with sodium. 7. The photo detector as claimed in claim 6 , wherein a luminescent spectrum of the cesium iodide doped with thallium is substantially between 450 nm and 650 nm, and a luminescent spectrum of the cesium iodide doped with sodium is between 370 nm and 500 nm. 8. The photo detector as claimed in claim 1 , further comprising a passivation layer located between the reflective layer and the photo conversion element. 9. The photo detector as claimed in claim 1 , further comprising a cover layer covering an upper surface and at least one side surface of the photo conversion element. 10. The photo detector as claimed in claim 1 , further comprising a filling layer filling between the photo conversion element and the sensor element array.
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