Photosensor having an emitter-encapsulating portion, receiver-encapsulating portion, and circuit-encapsulating portion connected to one another with a conductive leadframe

Patent metadata

Field	Value
Publication number	US-9312403-B2
Application number	US-201514625994-A
Country	US
Kind code	B2
Filing date	Feb 19, 2015
Priority date	Mar 15, 2014
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A photosensor includes an emitter element, an emitter-encapsulating portion, a receiver element, a receiver-encapsulating portion, a circuit portion, and a circuit-encapsulating portion. The emitter-encapsulating portion encapsulates the emitter element. The receiver-encapsulating portion encapsulates the receiver element. The circuit portion includes a luminous element for indicating an operation. The circuit-encapsulating portion encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator portion facing the luminous element. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are formed from the same resin material containing a light diffusing agent.

First claim

The invention claimed is:

1. A photosensor, comprising:
an emitter element;
an emitter-encapsulating portion encapsulating the emitter element;
a receiver element;
a receiver-encapsulating portion encapsulating the receiver element;
a circuit portion including a luminous element for indicating an operation; and
a circuit-encapsulating portion encapsulating the circuit portion and including an operation indicator portion facing the luminous element,
wherein the emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe, and are formed from the same resin material containing a light diffusing agent,
wherein the resin has a light transmittance of not less than 20% and not more than 60%.

2. The photosensor according to claim 1 , wherein the leadframe is formed integrally.

3. The photosensor according to claim 1 , wherein the emitter-encapsulating portion includes an emitter base and an emitter lens.

4. The photosensor according to claim 1 , wherein the receiver-encapsulating portion includes a receiver base and a receiver lens.

5. A photosensor, comprising:
an emitter element;
an emitter-encapsulating portion encapsulating the emitter element;
a receiver element;
a receiver-encapsulating portion encapsulating the receiver element;
a circuit portion including a luminous element for indicating an operation; and
a circuit-encapsulating portion encapsulating the circuit portion and including an operation indicator portion facing the luminous element,
wherein the thickness of a resin portion of the receiver-encapsulating portion covering a light receiving surface of the receiver element in a direction perpendicular to the light receiving surface is smaller than the thickness of a resin portion of the circuit-encapsulating portion covering a luminous surface of the luminous element in a direction perpendicular to the luminous surface.

6. The photosensor according to claim 5 , wherein
a surface of the receiver-encapsulating portion facing the light receiving surface includes a curved surface,
the thickness of a resin portion of the receiver-encapsulating portion between the light receiving surface of the receiver element and an apex of the curved surface is smaller than the thickness of a resin portion of the circuit-encapsulating portion covering the luminous surface of the luminous element in a direction perpendicular to the luminous surface.

7. A photosensor, comprising:
an emitter element;
an emitter-encapsulating portion encapsulating the emitter element;
a receiver element;
a receiver-encapsulating portion encapsulating the receiver element;
a circuit portion including a luminous element for indicating an operation; and
a circuit-encapsulating portion encapsulating the circuit portion and including an operation indicator portion facing the luminous element,
wherein the emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe, and are formed from the same resin material containing a light diffusing agent, and
wherein the thickness of a resin portion of the emitter-encapsulating portion covering a light emitting surface of the emitter element in a direction perpendicular to the light emitting surface is smaller than the thickness of a resin portion of the circuit-encapsulating portion covering a luminous surface of the luminous element in a direction perpendicular to the luminous surface.

8. The photosensor according to claim 7 , wherein
a surface of the emitter-encapsulating portion facing the light emitting surface includes a curved surface,
the thickness of a resin portion of the emitter-encapsulating portion between the light emitting surface of the emitting element and an apex of the curved surface is smaller than the thickness of a resin portion of the circuit-encapsulating portion covering the luminous surface of the luminous element in a direction perpendicular to the luminous surface.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Miyata Tsuyoshi
• Ohtsuki Kazuya
• Nakajima Jun
• Miyashita Seiji
• Imai Kiyoshi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title