Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9312072-B2
Application number	US-201313845175-A
Country	US
Kind code	B2
Filing date	Mar 18, 2013
Priority date	Mar 18, 2013
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.

First claim

What is claimed is:

1. A winding-type solid electrolytic capacitor package structure using a carrier board, comprising:
a substrate unit including a substrate body;
a capacitor unit including at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body, the positive conductive lead pin has a positive end surface, and the negative conductive lead pin has a negative end surface;
a package unit including a package body disposed on the substrate body to enclose the winding body, wherein the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface opposite to the first lateral surface and substantially flushed with the negative end surface; and
an electrode unit including a positive electrode structure covering the first lateral surface of the package body and electrically contacting the positive end surface of the positive conductive lead pin and a negative electrode structure covering the second lateral surface of the package body and electrically contacting the negative end surface of the negative conductive lead pin.

2. The winding-type solid electrolytic capacitor package structure of claim 1 , further comprising: an adhesion unit including at least one adhesive body, wherein the winding body is adhered to the top surface of the substrate body through the at least one adhesive body.

3. The winding-type solid electrolytic capacitor package structure of claim 1 , wherein the winding body has a positive foil sheet, a negative foil sheet and an isolation paper disposed between the positive foil sheet and the negative foil sheet, the positive foil sheet, the negative foil sheet and the isolation paper are rolled to form a cuboid capacitor core, and the positive conductive lead pin and the negative conductive lead pin respectively electrically contact the positive foil sheet and the negative foil sheet.

4. The winding-type solid electrolytic capacitor package structure of claim 3 , wherein the positive conductive lead pin has a first positive conductive portion inserted into the winding body and electrically contacting the positive foil sheet and a second positive conductive portion connected to the first positive conductive portion and extended and exposed from the winding body, and the negative conductive lead pin has a first negative conductive portion inserted into the winding body and electrically contacting the negative foil sheet and a second negative conductive portion connected to the first negative conductive portion and extended and exposed from the winding body.

5. The winding-type solid electrolytic capacitor package structure of claim 1 , wherein the positive electrode structure is extended from the first lateral surface of the package body to the top surface of the package body and the bottom surface of the substrate body, and the negative electrode structure is extended from the second lateral surface of the package body to the top surface of the package body and the bottom surface of the substrate body.

6. The winding-type solid electrolytic capacitor package structure of claim 1 , wherein the positive electrode structure includes a first positive conductive layer covering the first lateral surface of the package body and electrically contacting the positive end surface of the positive conductive lead pin, a second positive conductive layer covering the first positive conductive layer, and a third positive conductive layer covering the second positive conductive layer, wherein the negative electrode structure includes a first negative conductive layer covering the second lateral surface of the package body and electrically contacting the negative end surface of the negative conductive lead pin, a second negative conductive layer covering the first negative conductive layer, and a third negative conductive layer covering the second negative conductive layer, wherein both the first positive conductive layer and the first negative conductive layer are Ag layers, both the second positive conductive layer and the second negative conductive layer are Ni layers, and both the third positive conductive layer and the third negative conductive layer are Sn layers.

7. A method of manufacturing a winding-type solid electrolytic capacitor package structure using a carrier board, comprising:
providing a carrier body;
placing a plurality of winding capacitors on the carrier body, wherein each winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body, the positive conductive lead pin of each winding capacitor has a positive end surface, and the negative conductive lead pin of each winding capacitor has a negative end surface;
forming a package material on the carrier body to enclose the winding capacitors;
cutting the carrier body and the package material to separate the winding capacitors from each other, wherein the carrier body is cut into a plurality of substrate bodies for respectively carrying the winding capacitors, the package material is cut into a plurality of package bodies to respectively enclose the winding bodies of the winding capacitors, and each package body has a first lateral surface substantially flushed with the positive end surface of the corresponding winding capacitor and a second lateral surface opposite to the first lateral surface and substantially flushed with the negative end surface of the corresponding winding capacitor; and
forming a positive electrode structure to cover the first lateral surface of the package body and electrically contact the positive end surface of the positive conductive lead pin and forming a negative electrode structure to cover the second lateral surface of the package body and electrically contact the negative end surface of the negative conductive lead pin.

8. The method of claim 7 , wherein before the step of placing the winding capacitors on the carrier body, the method further comprises:
pressing the winding body of each winding capacitor from a cylinder into a cuboid, wherein each winding capacitor includes a positive soldering foot soldered on an end of the positive conductive lead pin and a negative soldering foot soldered on an end of the negative conductive lead pin;
removing the negative soldering foot of each winding capacitor by cutting;
soldering the positive soldering foot of each winding capacitor on a connection bar;
processing the winding capacitors by a carbonization process, a formation process and a polymer-impregnated process in sequence;
removing polymer that has been formed on an end portion of the negative conductive lead pin of each winding capacitor; and
removing the positive soldering foot of each winding capacitor by cutting.

9. The method of claim 7 , wherein the winding body of each winding capacitor is adhered to the top surface of the carrier body through at least one adhesive body in the step of placing the winding capacitors on the carrier body.

10. The method of claim 7 , wherein the winding body has a positive foil sheet, a negative foil sheet and an isolation paper disposed between the positive foil sheet and the negative foil sheet, the positive foil sheet, the negative foil sheet and the isolation paper are rolled to form a cuboid capacitor core, and the positive conductive lead pin and the negative conductive lead pin respectively electrically contact the positive foil sheet and the negative foil sheet

Assignees

• Apaq Technology Co Ltd

Inventors

• Chen Ming-Tsung
• Lin Ching-Feng

Classifications

• H01G9/012 Primary

  specially adapted for solid capacitors · CPC title

• H01G9/0029 Primary

  Processes of manufacture · CPC title

• H01G9/151

  with wound foil electrodes · CPC title

• H01G13/006

  Apparatus or processes for applying terminals · CPC title

• Y10T29/417

  Cross-Sectional Technologies · mapped topic