Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
US-12073996-B2 · Aug 27, 2024 · US
US9310772B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9310772-B2 |
| Application number | US-201414204150-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2014 |
| Priority date | Mar 14, 2013 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less. The metal structure preferably has one or more of a stress relaxation rate of 10% or less, a lattice constant of 3.535 Å to 3.56 Å, a yield stress of 1500 MPa or more, a Young's modulus of 150 GPa or more and a Vickers hardness of Hv 580 or more.
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The invention claimed is: 1. A metal structure comprising, by mass %: Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, wherein a maximum grain size of the metal structure is 500 nm or less, and wherein a stress relaxation rate of the metal structure is 10% or less. 2. The metal structure according to claim 1 , wherein a lattice constant of the metal structure is 3.535 Å to 3.56 Å. 3. The metal structure according to claim 1 , wherein a yield stress of the metal structure is 1500 MPa or more and a Young's modulus of the metal structure is 150 GPa or more. 4. The metal structure according to claim 1 , wherein a Vickers hardness of the metal structure is Hv 580 or more. 5. A spring component which is formed by the metal structure according to claim 1 . 6. A timepiece which uses the spring component according to claim 5 as a component thereof. 7. The metal structure according to claim 2 , wherein a yield stress of the metal structure is 1500 MPa or more and a Young's modulus of the metal structure is 150 GPa or more. 8. The metal structure according to claim 2 , wherein a Vickers hardness of the metal structure is Hv 580 or more. 9. The metal structure according to claim 3 , wherein a Vickers hardness of the metal structure is Hv 580 or more. 10. The metal structure according to claim 7 , wherein a Vickers hardness of the metal structure is Hv 580 or more. 11. A spring component which is formed by the metal structure according to claim 2 . 12. A spring component which is formed by the metal structure according to claim 3 . 13. A spring component which is formed by the metal structure according to claim 4 . 14. A spring component which is formed by the metal structure according to claim 7 . 15. A spring component which is formed by the metal structure according to claim 8 . 16. A method of manufacturing a metal structure, the method comprising: forming by an electroforming a metal structure including, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities; and performing a heat treatment to the metal structure under conditions in which a heat treatment temperature is 140° C. to 350° C. and a Larson-Miller parameter is in a range from 7500 to 9500. 17. The method of manufacturing a metal structure according to claim 16 , wherein the heat treatment temperature is equal to or higher than 140° C. and lower than 275° C. 18. A chronograph coupling lever for a timepiece, the chronograph coupling lever comprising: a spring component, wherein the spring component includes a metal structure, wherein the metal structure includes by mass %, Fe: 10% to 30%, S: 0.005% to 0.2%, and the balance consisting of Ni and unavoidable impurities, and wherein a maximum grain size of the metal structure is 500 nm or less. 19. A timepiece comprising: a chronograph coupling lever having a spring component which uses the chronograph coupling lever for a timepiece, wherein the spring component includes a metal structure, wherein the metal structure includes by mass %, Fe: 10% to 30%, S: 0.05% to 0.2%, and the balance consisting of Ni and unavoidable impurities, and wherein a maximum grain size of the metal structure is 500 nm or less.
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